Summary of ASIC Industry Update Industry Overview - The document provides an update on the ASIC (Application-Specific Integrated Circuit) projects of major North American hyperscaler companies, including AWS, Microsoft, Meta, Google, OpenAI, Apple, and TikTok [2][3] Key Companies and Their ASIC Projects AWS (Amazon Web Services) - **Tranium 2 Chip**: Expected to reach its end phase in Q4 2025, with a transitional chip, Tranium 2.5, to be produced in Q4 2025 and Q1 2026. Marvell is expected to ship approximately 200,000 units per quarter [4][3] - **Tranium 3 Chip**: Forecasted production volume of around 2.5 million units, with potential allocation of up to 500,000 units to Marvell if Tranium 2.5 production is successful [8][9] - **Tranium 4 Chip**: Designed by Annapurna and Alchip, expected to start mass production in Q4 2027 [9][10] Microsoft - **Cobalt 200 CPU and MAIA 200 Sphinx**: Designed by GUC, with MAIA 300 Griffin facing challenges in its development with Marvell. Microsoft may shift to Broadcom if confidence in Marvell wanes [14][16] - **MAIA 200 and MAIA 300**: Part of the second-generation ASIC accelerator series, with the contract with Marvell expiring in H1 2026 [15][16] Meta - **ASIC Roadmap**: Includes multiple generations of chips, with the first-generation inference chip, Artemis, already in mass production. The second-generation training chip, Athena, is set for Q4 2023, and the third-generation chip, Iris, is planned for Q3 2024 [17][18] - **Arke Chip**: A simplified inference-only chip designed by Broadcom and Marvell, expected to help Meta keep pace with NVIDIA's chip iterations [19][20] Google - **TPU Development**: The first-generation ASIC Server CPU, Axion, is designed by Marvell, while the second-generation, Tamar, is designed by GUC. Google expects to produce about 4 million TPUs in 2026, with significant internal use [22][24] - **Demand Surge for Optical Modules**: Due to the increase in TPU production, demand for 1.6T optical modules is expected to rise dramatically from 3 million units in 2025 to 20 million in 2026 [25][26] OpenAI - **Titan 1 and Titan 2 Chips**: Broadcom is developing these chips, with expected shipments of 300,000 units in 2026 and at least 600,000 units in 2027 [28][29] - **Collaboration with ARM**: OpenAI is also working with ARM on ASIC projects, indicating a dual approach to chip development [30][31] Apple - **ASIC Projects**: Apple is customizing two ASIC chips, with mass production not expected before 2027 [32][33] TikTok - **Neptune Chip**: After negotiations, TikTok is expected to resume mass production of its ASIC chip in Q1 2026, with an anticipated production volume of 500,000 units [34][35] GUC (Global Unichip Corp) - **Controversial Position**: GUC is involved in the production of Google's Tamar CPU but is also engaged in more profitable projects like Tesla's AI5 chip, which could generate significant revenue in 2027 [41][43] Additional Insights - The document highlights the competitive landscape among major players in the ASIC market, with companies like Marvell, GUC, and Broadcom playing crucial roles in the design and production of these chips [41][42] - The anticipated growth in demand for ASIC chips, particularly in the context of AI and machine learning applications, suggests a robust market outlook for the coming years [25][26] This summary encapsulates the key developments and projections within the ASIC industry, focusing on the major players and their respective projects.

Financial Data and Key Metrics Changes - In Q2 2025, consolidated revenue was NT$ 8.9 billion with a gross margin of approximately 28.7% [6][8] - Net income attributable to shareholders was NT$ 8.9 billion, with earnings per share (EPS) of NT$ 0.71, up from NT$ 0.62 in the previous quarter [8][12] - Utilization rate increased from 59% in Q1 to 76% in Q2, contributing to a 1.6% sequential revenue increase [7][12] - For the first half of 2025, revenue increased by 4.7% year-over-year, while gross margin decreased from 33.1% in the same period of 2024 to 27.7% [8][9] Business Line Data and Key Metrics Changes - Revenue from the 22 and 28 nanometer portfolio accounted for 40% of total sales, marking a record high [12][13] - The consumer segment's revenue contribution decreased to 33%, while the communication segment increased to 41% [9][10] - The revenue from below 40 nanometer technology represented more than half of total revenue, reaching 55% in Q2 [10] Market Data and Key Metrics Changes - Revenue breakdown showed Europe at 8%, Asia at 67%, and ICM at 19%, with slight changes from the previous quarter [9] - The company noted a healthy demand in the automotive and industrial segments, while consumer and communication segments remained stable [35][36] Company Strategy and Development Direction - The company plans to enhance supply chain resilience through the new Phase III facility in Singapore, set to start production in 2026 [13][14] - UMC aims to maintain and improve ASP resilience by differentiating technology offerings and increasing revenue contributions from advanced nodes [20][21] - The focus remains on specialty technology solutions, particularly in high voltage and low power applications, to reduce competition with Chinese foundries [70][71] Management's Comments on Operating Environment and Future Outlook - Management expressed caution regarding the impact of U.S. tariff policies and geopolitical uncertainties on demand [14][29] - The company anticipates a mild increase in wafer shipments for Q3, but expects NT dollar revenue to decline due to adverse foreign exchange movements [15][16] - The overall growth outlook for 2025 remains unchanged, with expectations to outgrow the addressable market [54][55] Other Important Information - The cash-based capital expenditure budget for 2025 remains unchanged at US$ 1.8 billion [10][17] - The company is closely monitoring foreign exchange exposure and maintaining financial flexibility to enhance resilience [14][15] Q&A Session Summary Question: ASP trend outlook for 2026 - Management does not provide guidance beyond 2025 but aims to maintain ASP resilience through technology differentiation and product mix [20][21] Question: Tariff impacts on customer behavior - There is observed demand upside in Q2 and Q3, partly driven by inventory buildup in anticipation of potential U.S. tariffs [28][29] Question: Advanced packaging technology development - UMC is preparing advanced packaging solutions to address energy consumption needs in cloud AI and edge AI markets [31][32] Question: Gross margin recovery pathway - Management aims to improve gross margins through technology development and improved product mix, with a realistic goal to return to mid-30s gross margins [45][48] Question: Utilization rates in China - The China facility is running at full capacity, above corporate average, with no pricing differentiation between locations [94]

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging industry. Core Insights - Advanced packaging is essential for overcoming semiconductor performance bottlenecks, enabling higher speeds and efficiency through enhanced interconnect density and improved thermal management [1][4][8]. - The advanced packaging market is projected to grow at a compound annual growth rate (CAGR) of approximately 12% from 2024 to 2029, with high-end performance packaging expected to grow at a CAGR of 37% [4][54][55]. - Hybrid bonding technology is highlighted as a key evolution in semiconductor performance, offering significant advantages in terms of cost, efficiency, and application potential [4][89]. Summary by Sections Advanced Packaging Key to Future Scaling - Moore's Law has led to increased transistor density, but performance metrics like single-thread performance and power efficiency have not kept pace, creating bottlenecks [7][11]. - Advanced packaging addresses these limitations by improving interconnect density and thermal management, allowing chips to operate at higher speeds [8][11]. Semiconductor Architecture Evolution - The shift from monolithic System-on-Chip (SoC) designs to 2D chiplets allows for modular chip design, optimizing cost and performance [16][21]. - 2.5D and 3D packaging techniques enhance data transfer efficiency and increase transistor density [25][26]. Bonding and Packaging Technologies - The evolution of bonding technologies from wire bonding to hybrid bonding reflects the industry's need for higher precision and density in interconnects [62][64]. - Hybrid bonding enables direct copper-to-copper interconnects, significantly reducing latency and increasing interconnect density [95][89]. Market Growth and Trends - The advanced packaging market is expected to reach $84 billion by 2029, driven by innovations in AI, 5G/6G, and autonomous driving technologies [54][40]. - High-end performance packaging, particularly in segments like 3D NAND and HBM, is projected to contribute significantly to market growth [55][48]. Adoption of Hybrid Bonding - Hybrid bonding is currently limited to high-end applications but is expected to see wider adoption due to its performance advantages over traditional methods [4][89]. - Companies like AMD and Intel are early adopters of hybrid bonding, indicating a trend towards its increased use in advanced semiconductor applications [4][89]. Competitive Landscape - The advanced packaging equipment market features several competitors, with BE Semiconductor (Besi) noted for its strong position in hybrid bonding [4][54]. - The report emphasizes the need for semiconductor manufacturers to invest in advanced packaging technologies to remain competitive [84][85].

Financial Data and Key Metrics Changes - The company recorded fully diluted EPS of $1.64 and basic EPS of $1.75 for the first quarter, with consolidated net revenues declining by 9% sequentially but increasing by 12% year over year [9][12] - Gross profit was NT$24.9 billion with a gross margin of 16.8%, improving by 0.4 percentage points sequentially and 1.1 percentage points year over year [10][12] - Operating profit was NT$9.7 billion, down NT$1.5 billion sequentially but up NT$2.2 billion year over year, with an operating margin decline of 0.4 percentage points sequentially and an improvement of 0.9 percentage points year over year [11][12] Business Line Data and Key Metrics Changes - In the ATM business, revenues were NT$86.7 billion, down NT$1.7 billion sequentially but up NT$12.8 billion year over year, representing a 2% decline sequentially and a 17% increase annually [15] - The EMS business reported revenues of NT$62.3 billion, declining NT$12.6 billion or 17% sequentially, while increasing NT$2.9 billion or 5% year over year [23] Market Data and Key Metrics Changes - The company noted a potential shallower seasonal dip in EMS business due to customers adjusting order flow patterns, indicating a more stable demand environment [6][23] - The computing segment within the ATM business saw significant growth, particularly driven by stable high demand for AI products, while other segments like handsets were seasonally impacted [19] Company Strategy and Development Direction - The company aims to minimize short-term noise to focus on long-term signals, emphasizing the importance of technological trends and process improvements to maintain competitive advantages [7][8] - The company is committed to increasing its market share in the testing segment, targeting a contribution of 19% to 20% of overall ATM revenue by year-end [21][22] Management Comments on Operating Environment and Future Outlook - Management expressed confidence in the second quarter outlook, expecting ATM revenues to grow by 9% to 11% quarter over quarter, while EMS revenues are projected to decline by 10% year over year [30][31] - The management acknowledged the challenges posed by macroeconomic volatility but remains focused on long-term strategic investments [6][8] Other Important Information - The company anticipates a peak in net debt to equity ratio at around 60% in the third quarter of the year, with total unused credit lines amounting to NT$358.4 billion [26] - Capital expenditures for the first quarter totaled NT$892 million, with significant investments planned for machinery and equipment to support future product demands [27][28] Q&A Session Summary Question: AI test market share and CapEx on testing - Management confirmed aggressive investments in the test segment, aiming to increase market share, particularly in AI chip testing, with a target of reaching 20% of ATM revenue by year-end [34][36] Question: U.S. investments and capacity planning - The company is evaluating opportunities for operations in the U.S. to support customer demand, with no specific investment size or timing details available yet [42][44] Question: Market share in AI testing across different products - Management indicated that while they do not have a detailed breakdown of market share by product, they are focused on expanding their test business across all areas, including AI chips [47][49] Question: Impact of tariffs on business - Management stated that the direct exposure to U.S. tariffs is minimal, with less than 10% of EMS shipments going directly to the U.S., and they do not anticipate significant impacts from potential tariffs [93][94] Question: General demand outlook for consumer electronics and automotive - Management noted a gradual recovery in most sectors, with high-end automotive showing better momentum, while lower-end segments are still undergoing inventory corrections [97]

Financial Data and Key Metrics Changes - The company reported fully diluted EPS of $1.64 and basic EPS of $1.75 for Q1 2025, with consolidated net revenues declining by 9% sequentially but increasing by 12% year over year [8][12] - Gross profit was NT$24.9 billion with a gross margin of 16.8%, improving by 0.4 percentage points sequentially and 1.1 percentage points year over year [9][10] - Operating profit was NT$9.7 billion, down NT$1.5 billion sequentially but up NT$2.2 billion year over year, with an operating margin of 7.1% [11][13] Business Line Data and Key Metrics Changes - ATM business revenues were NT$86.7 billion, down NT$1.7 billion sequentially but up NT$12.8 billion year over year, representing a 2% decline sequentially and a 17% increase annually [15] - EMS business revenues were NT$62.3 billion, declining NT$12.6 billion or 17% sequentially, while increasing NT$2.9 billion or 5% year over year [22] Market Data and Key Metrics Changes - The company noted a potential shallower seasonal dip in EMS business due to customers adjusting order flow patterns [6] - The computing segment within the ATM business saw significant growth, driven by stable high demand for AI products, while handsets and communications devices were seasonally impacted [18] Company Strategy and Development Direction - The company aims to minimize short-term noise to focus on long-term signals, emphasizing the importance of technological trends and process improvements [7][8] - The company is committed to expanding its test business, targeting a market share increase to 19%-20% of overall ATM revenue by year-end [20][21] Management's Comments on Operating Environment and Future Outlook - Management expressed concerns about volatility impacting long-term planning but remains focused on core industry trends [6][7] - For Q2 2025, ATM revenues are expected to grow by 9% to 11% quarter over quarter, while EMS revenues are projected to decline by 10% year over year [30][31] Other Important Information - The company anticipates a peak in net debt to equity ratio at around 60% in Q3 2025, with total unused credit lines amounting to NT$358.4 billion [25] - Capital expenditures for Q1 2025 totaled NT$892 million, with significant investments in testing operations [26][27] Q&A Session Summary Question: AI test market share increase - Management confirmed that the focus is on expanding market share in AI chip testing, particularly for GPUs, and emphasized the economic returns from test investments [34][37] Question: U.S. investments and capacity - Management is evaluating opportunities for U.S. operations to support customer needs but has not finalized investment details [40][42] Question: Market share in AI testing - Management stated they are a dominant player in wafer sort testing and are aggressively moving into final testing, expecting significant growth in the second half of the year [48][50] Question: Tariff impact - Management indicated that the direct exposure to U.S. tariffs is minimal, with less than 10% of EMS shipments going directly to the U.S. [94][96] Question: General demand outlook - Management noted a gradual recovery in consumer electronics, with automotive demand showing better momentum, particularly in high-end segments [97][98]