Core Viewpoint - The CPO (Co-Packaged Optics) technology is gaining traction in the optical communication sector, with significant stock price increases for companies involved in this field, indicating a growing market interest and potential investment opportunities [1][2]. Group 1: Stock Performance - Tianfu Communication (300394.SZ) saw a price increase of 12.12%, reaching 76.20, with a market capitalization of 591.2 billion [2]. - LianTe Technology (301205.SZ) experienced a 10.66% rise, with a current price of 80.47 and a market cap of 54.7 billion [2]. - Zhongji Xuchuang (300308.SZ) reported a 7.93% increase, with a price of 116.54 and a market cap of 1288.5 billion [2]. - Bochuang Technology (300548.SZ) increased by 6.35%, reaching 56.07, with a market cap of 150.5 billion [2]. - Dekeli (688205.SS) rose by 6.32%, with a price of 67.00 and a market cap of 59.1 billion [2]. - Guangxun Technology (002281.SZ) saw a 5.58% increase, with a price of 45.61 and a market cap of 352.6 billion [2]. Group 2: CPO Technology Developments - Broadcom announced the delivery of the Tomahawk 6 (TH6) switch chip, which supports both conventional and CPO versions [3]. - TSMC is accelerating its co-packaged optical technology, expecting to have production lines ready by June 2025, with small-scale production in the second half of 2025 and mass production starting in 2026 [3]. - NVIDIA introduced co-packaged optical switches at the GTC conference, with InfiniBand CPO expected to launch in the second half of 2025 and Ethernet CPO planned for the second half of 2026 [3]. Group 3: Market Insights - CPO technology enables miniaturization and integration of high-speed optical modules, reducing chip packaging size and improving system integration [4]. - The technology facilitates direct connections from CPUs and GPUs to various devices, enhancing resource pooling and memory disaggregation while minimizing signal transmission loss and power consumption [4]. - The CPO market generated approximately $3.8 million in revenue in 2022, projected to reach $2.6 billion by 2033, with a compound annual growth rate (CAGR) of 46% from 2022 to 2033 and 80% from 2028 to 2033 [5].

据人民日报6月10日报道，任正非在访谈中表示，中国在中低端芯片上是可以有机会的，中国数十、上 百家芯片公司都很努力。 其表示硅基芯片，我们用数学补物理、非摩尔补摩尔，利用集群计算的原理，可以达到满足我们现在的 需求。还提到人工智能也许是人类社会最后一次技术革命。 国盛证券指出，进入大模型时代以来，随着集群规模加速扩大，计算卡之间的互联要求快速提升。国内 如豆包，可灵等优秀大模型不断扩张，将带动国内算力建设上行，国产交换机作为构建中国算力集群的 核心环节，将打开新的上升周期。 公司方面，据长江证券表示， 国金证券也表示，海外大模型厂商在2024年已开始大规模部署800G交换机用于训练。在国内大模型市 场中，800G交换机在组网中已初现端倪。Dell'Oro Group预计到2025年800G交换端口采用率有望超过 400G数据中心交换端口，将占数据中心交换机端口的25%以上。 其还指出，当前CPO行业处于快速发展阶段。行业内的领军企业如英特尔、博通和美满科技等已推出多 款基于CPO技术的量产产品。 根据智研咨询数据，全球CPO交换机的销售量预计将从2023年的5万端口迅速增长至2027年的450万端 口。大集群 ...