Core Viewpoint - The article discusses the emergence of a new paradigm in advanced packaging design and EDA (Electronic Design Automation), emphasizing the need for a collaborative framework that integrates various processes and technologies to meet the increasing demands of applications like AI and high-bandwidth storage [4][5][9]. Group 1: Advanced Packaging and EDA Paradigm - The demand for computational power driven by applications such as AI and smart vehicles has shifted advanced packaging from backend testing to frontend system architecture design [4]. - The rapid industrialization of 2.5D/3D advanced packaging has revealed a gap in practical user implementation due to complex processes and design challenges [4][5]. - A new EDA paradigm is necessary to facilitate cross-process, cross-chiplet, and cross-physical field collaboration, enabling a unified data model for design and standardized interfaces for manufacturing processes [5][9]. Group 2: Collaboration and Integration - Silicon Core Technology has partnered with multiple advanced packaging manufacturers to create a standardized database that converts dispersed process parameters into models directly usable by design tools [7]. - This integration allows for early-stage cross-process interconnection planning and reliability assessments, significantly reducing rework and streamlining the design-to-verification process for multi-chiplet systems [7][9]. - The collaboration between process rules and design workflows enables a comprehensive approach to architecture planning, design, simulation, and verification for multi-chiplet systems [9]. Group 3: Future Directions and Industry Collaboration - The rise of multi-chip designs has created new intersections for technology, where traditional single-chip tools provide stable foundational capabilities while multi-chip design tools address system-level analyses [11][13]. - The article suggests that tool-level collaboration based on specific scenarios may be more aligned with the current pace of domestic EDA development than large-scale mergers [13][14]. - Looking ahead, Silicon Core Technology aims to enhance collaboration across the industry to strengthen the capabilities of domestic EDA tools and foster a more synergistic semiconductor ecosystem [16].