Core Viewpoint - The semiconductor industry is experiencing a significant transformation to meet the increasing demand for advanced technologies, with a projected production of 1 trillion chips in 2024, equating to 100 chips per person on Earth [1]. Group 1: Industry Trends - The rise of artificial intelligence (AI) and the demand for high-performance devices are driving innovations in semiconductor technology, particularly in 3D NAND and other advanced memory technologies [1]. - The manufacturing process is evolving with the introduction of metallization techniques, which involve depositing thin metal layers to create circuits, essential for advanced chip production [2]. Group 2: Material Advancements - Tungsten has been the primary material for interconnects for the past 25 years, but its performance is reaching its limits due to the increasing complexity of chip structures, particularly in 3D NAND and DRAM [2]. - Molybdenum is emerging as a superior alternative to tungsten, offering advantages such as lower resistivity, reduced manufacturing steps, and better scalability as device sizes shrink and layer counts increase [3][4]. Group 3: Challenges and Solutions - Despite its advantages, molybdenum has not yet been widely adopted in metallization processes due to the lack of developed atomic layer deposition (ALD) methods that meet its requirements [7]. - The development of solid precursors for ALD and engineering low-resistance interfaces are critical for the successful implementation of molybdenum in semiconductor manufacturing [10].