Core Viewpoint - The company plans to invest 1.5 billion yuan in the construction of a new generation PCB manufacturing base project named "Chip Innovation Smart Carrier," which has received recognition from major automotive OEMs and is expected to commence production in the second half of 2026 [1] Group 1: Investment and Project Development - The investment amount for the "Chip Innovation Smart Carrier" project is set at 1.5 billion yuan [1] - The project involves "chip-embedded PCB packaging technology," which has gained acceptance from several mainstream automotive manufacturers and OEMs [1] - Production for the project is anticipated to start in the second half of 2026 [1] Group 2: Corporate Governance and Compensation - The chairman of the company does not receive a salary, while other non-independent directors receive compensation based on their administrative roles [1] - Independent directors receive director allowances [1] - Compensation details for directors and senior management will be disclosed in the 2025 annual report, as relevant directors are newly appointed in 2025 [1] - The company has established an internal incentive system to enhance management's motivation and accountability, with plans to consider stock incentives at an appropriate time [1]

Core Viewpoint - The company plans to invest approximately 1.5 billion RMB in the "Chip Innovation and Intelligence Carrier" project to enhance the production capacity of embedded chip PCB products and advanced HDI circuit boards [1] Group 1 - The project aims to scale up the production of embedded chip PCB products and improve the capacity of high-end HDI products [1] - The planned design capacity for the project is 660,000 square meters per year [1]