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江苏半导体材料“小巨人”,启动IPO
Sou Hu Cai Jing· 2026-02-06 07:43
Company Overview - Yongzhi Co., Ltd. is a semiconductor packaging materials company based in Taizhou, Jiangsu, established in October 2007 with a registered capital of 113.3 million yuan [4][5] - The company is currently in the process of applying for an IPO on the Beijing Stock Exchange, with Huatai United Securities as the advisory institution [2] Financial Performance - Yongzhi's revenue for the years 2023, 2024, and the first five months of 2025 were 775 million yuan, 981 million yuan, and 452 million yuan respectively [5] - The net profit for the same periods was 2 million yuan, 60 million yuan, and 33 million yuan respectively [5] - Research and development expenses for the years 2023, 2024, and the first five months of 2025 were 29 million yuan, 30 million yuan, and 14 million yuan respectively [5] Product Offerings - Yongzhi specializes in the research, production, and sales of integrated circuit lead frames and advanced packaging substrates, aiming to provide core materials and solutions for the global semiconductor packaging industry [6] - Key products include: - Stamped lead frames for various applications, including TO series and IPM module frames [6] - Etched lead frames with advanced processing capabilities [6][7] - Advanced packaging substrates such as pre-formed MIS substrates and DBC/AMB ceramic substrates for high-power modules [7] Corporate Structure - The company is controlled by its chairman, Xiong Zhi, who holds a 43.65% stake [4] - Yongzhi has multiple subsidiaries, enhancing its operational capabilities in the semiconductor sector [6] Industry Recognition - In 2024, Yongzhi was recognized as a national-level "specialized, refined, and innovative" small giant enterprise [5]
中科院孵化,高分子“小巨人”,冲IPO!
Sou Hu Cai Jing· 2025-12-11 18:44
Core Viewpoint - Jiangsu Zhongke Kehua New Materials Co., Ltd. (referred to as "Zhongke Kehua") has received acceptance for its IPO on the Sci-Tech Innovation Board, aiming to raise 598 million yuan for the industrialization of high-end epoxy molding compounds for semiconductor packaging and the establishment of a research center [1][4]. Fundraising and Project Allocation - The IPO intends to raise 598 million yuan, with 420 million yuan allocated for the industrialization project of high-end epoxy molding compounds and 98 million yuan for the research center [1][3]. - The company plans to add a design capacity of 22,500 tons for epoxy molding compounds [1]. Company Background - Zhongke Kehua was established in October 2011 with a registered capital of 66 million yuan and is recognized as a national-level "little giant" enterprise specializing in specific and innovative technologies [1][4]. - The controlling shareholder is Beijing Kehua, founded in 1984, which is one of the earliest industrial bases for epoxy molding compounds in China [4]. Market Position and Competition - The domestic semiconductor packaging materials market is primarily dominated by foreign companies, with a localization rate of about 30%, and high-end products are mainly monopolized by Japanese manufacturers [7]. - Zhongke Kehua has become one of the few domestic companies capable of independent R&D and large-scale production of high-end epoxy molding compounds, currently holding the second-largest market share in China [9]. Financial Performance - From 2022 to the first half of 2025, Zhongke Kehua's revenue has shown a steady increase, with figures of 200 million yuan, 250 million yuan, 331 million yuan, and 159 million yuan respectively, alongside a rising net profit trend [11]. - The gross profit margin has improved from 22.68% in 2022 to 30.69% in the first half of 2025, indicating a positive growth trajectory primarily driven by high-end epoxy molding compound sales [11]. Product Development and Innovation - The company has developed a new granular epoxy molding compound for fan-out wafer-level packaging, which has been recognized for its advanced performance, filling a domestic gap [11]. - Zhongke Kehua's product lines include basic, mid-range, and high-end epoxy molding compounds, with the latter gradually passing validation from downstream packaging and testing companies [9][11]. Supply Chain and Raw Materials - The top five raw material suppliers for Zhongke Kehua include companies like Ruile New Materials and Shengquan Group, with over 60% of total procurement coming from these suppliers [8].