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兴森科技:公司CSP封装基板整体产能规模5万平米/月,原3.5万平米/月产能已满产
Mei Ri Jing Ji Xin Wen· 2026-01-30 04:30
Group 1 - The company has a current CSP packaging substrate capacity of 50,000 square meters per month, with the previous capacity of 35,000 square meters per month now fully utilized [2] - The company is expanding its capacity by an additional 15,000 square meters per month, and the ramp-up progress is reported to be fast [2] - The overall industry demand is currently good, and future expansion plans will depend on market demand conditions [2]