每经AI快讯，有投资者在投资者互动平台提问：董秘您好，请简要分析一下今年行业需求与贵司相关 业务可否延续去年供不应求状态；目前贵司FCBGA封装基板业务与相关客户的验测状况是否顺利，今 年可否扭亏为盈？最后一个问题，目前最新股东人数是多少？感谢董秘！ 兴森科技（002436.SZ）2月24日在投资者互动平台表示，尊敬的投资者，您好！2025年以来全球PCB行 业仍延续结构分化的复苏态势，AI产业仍为主要驱动力。根据Prismark报告，预计2025年全球PCB行业 的产值为848.91亿美元、同比增长15.4%。公司CSP封装基板业务行业整体需求较好，后期公司将根据 市场需求情况适时启动扩产。公司FCBGA封装基板业务市场拓展、客户认证均按计划稳步推进中，具 体业务情况请关注公司定期报告。截至2026年2月10日，公司股东总户数为十二万七千余户。感谢您的 关注。 （文章来源：每日经济新闻） ...

Group 1 - The company, Xingsen Technology, stated that its FCBGA packaging substrates are primarily used in high-performance chip fields such as CPU, GPU, FPGA, and ASIC [2] - The CSP packaging substrates are mainly utilized in storage and RF chip sectors, with an overall production capacity of 50,000 square meters per month [2] - The previous capacity of 35,000 square meters per month has reached full production, and the new expansion of 15,000 square meters per month is progressing rapidly [2] - The overall industry demand is currently strong, and future expansion plans will depend on market demand [2]

（文章来源：每日经济新闻） 每经AI快讯，兴森科技（002436.SZ）1月30日在投资者互动平台表示，公司与主要客户的合作均正常推 进，随着扩产产能的释放，CSP封装基板业务的规模有望进一步提升。 ...

每经AI快讯，有投资者在投资者互动平台提问：今年是否有继续扩产bt载板的产能的规划？ 兴森科技（002436.SZ）1月30日在投资者互动平台表示，公司CSP封装基板整体产能规模5万平米/月， 原3.5万平米/月产能已满产，新扩1.5万平米/月产能爬坡进度较快，目前行业整体需求较好，后续扩产 计划需视市场需求情况确定。 （文章来源：每日经济新闻） ...

Core Viewpoint - The company has provided updates on its IC packaging business, specifically regarding capacity utilization rates and expansion plans for its FCBGA production line [1] Group 1: Capacity Utilization - The overall capacity scale for CSP packaging substrates is 50,000 square meters per month, with the original capacity of 35,000 square meters per month now fully utilized [1] - The newly expanded capacity of 15,000 square meters per month is ramping up quickly [1] Group 2: Market Development - The market expansion and customer certification for the FCBGA packaging substrate project are progressing steadily as planned [1] - The company advises stakeholders to monitor its future regular reports for more detailed operational updates [1]

Group 1 - The core viewpoint of the article is that Xingsen Technology's CSP packaging substrate business and its collaboration with key clients in Beijing Xinfai HDI boards and similar carrier boards are progressing normally, despite confidentiality agreements preventing the disclosure of specific client information [2]

Core Viewpoint - The company, Xingsen Technology, is actively expanding its market presence and customer base in the CSP packaging substrate sector, which serves various chip applications [1] Group 1: Company Overview - Xingsen Technology's CSP packaging substrates are utilized in storage chips, application processor chips, sensor chips, and RF chips, indirectly supplying domestic mobile phone manufacturers [1] - The company's Beijing subsidiary, Xinfai, produces Anylayer HDI and similar substrates primarily for high-end smartphone mainboards and sub-boards [1] Group 2: Market Strategy - The company is committed to actively pursuing market expansion and aims to increase its market share and establish benchmark customers [1]

Group 1 - The company, Xingsen Technology, confirmed that cooperation with major clients is progressing normally [2] - The expansion of production capacity is expected to enhance the scale of CSP packaging substrate business [2]

Core Viewpoint - The company, Xingsen Technology, has indicated that its CSP packaging substrate customer base includes major Korean and domestic memory chip clients, with product pricing and gross margins being dependent on specific product structure, size, and processes, making it difficult to generalize [1] Group 1 - The customer base for Xingsen Technology's CSP packaging substrates includes both Korean and domestic major memory chip clients [1] - Product pricing and gross margins are influenced by specific factors such as product structure, size, and manufacturing processes [1] - The company emphasizes that it is not feasible to generalize pricing and gross margin information across all products [1]

Core Viewpoint - The company Xingsen Technology (002436) has confirmed that its CSP packaging substrates are primarily used in storage chips, and its technology and production capacity can meet the demands of downstream customers [1] Group 1 - The main application area for the company's CSP packaging substrates is in storage chips [1] - The company has the technological capabilities to satisfy the needs of its downstream clients [1]