证券日报网讯兴森科技（002436）11月25日在互动平台回答投资者提问时表示，公司的CSP封装基板应 用领域涵盖存储芯片、应用处理器芯片、传感器芯片、射频芯片等，在存储芯片、射频芯片等领域间接 供应国内手机厂商；北京兴斐的AnylayerHDI、类载板主要应用于高端智能手机的主板、副板等领域。 公司会积极进行市场拓展，努力拓展标杆客户和市场份额。 ...

证券日报网讯兴森科技11月24日在互动平台回答投资者提问时表示，公司与主要客户的合作均正常推 进，随着扩产产能的释放，CSP封装基板业务的规模有望进一步提升。 （文章来源：证券日报） ...

格隆汇11月24日丨兴森科技(002436.SZ)在投资者互动平台表示，公司CSP封装基板的客户群体包括韩系 和国内存储芯片大客户，产品价格及毛利与具体产品结构、尺寸、工艺等相关，无法一概而论。 ...

Core Viewpoint - The company Xingsen Technology (002436) has confirmed that its CSP packaging substrates are primarily used in storage chips, and its technology and production capacity can meet the demands of downstream customers [1] Group 1 - The main application area for the company's CSP packaging substrates is in storage chips [1] - The company has the technological capabilities to satisfy the needs of its downstream clients [1]

Core Viewpoint - The company, Xingsen Technology, is experiencing a recovery in the downstream storage chip sector, leading to a full order book for its CSP packaging substrates, indicating a positive market outlook [1] Group 1: Company Operations - The application fields of the company's chip products are determined by customer needs, with specific customer information kept confidential due to non-disclosure agreements [1] - The FCBGA packaging substrate project is currently in small-batch production, with market expansion and customer certification progressing as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]

Core Viewpoint - The company indicates that the application fields of its chip products are determined by customer needs, with specific customer information being confidential due to non-disclosure agreements [1] Group 1: Company Performance - The company reports a full order book for CSP packaging substrates due to the recovery in the downstream storage chip sector, suggesting that overall market conditions are expected to remain favorable [1] - The FCBGA packaging substrate project is currently in the small-batch production stage, with market expansion and customer certification progressing as planned [1] Group 2: Market Dynamics - The timeline for mass production of the FCBGA project primarily depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]

Core Viewpoint - The company, Xingsen Technology, has confirmed that one of the main application areas for its CSP packaging substrates is storage chips, indicating that its technology and production capacity can meet downstream customer demands [1]. Group 1 - The company specializes in CSP packaging substrates [1] - The primary application area for the company's products is in storage chips [1] - The company's technology and production capacity are aligned with the needs of downstream customers [1]

Core Viewpoint - The company, Xingsen Technology, is focusing on the development of IC packaging substrates, which are essential materials for chip packaging, targeting various sectors including CPU, GPU, FPGA, ASIC, and storage chips [2] Group 1: Business Focus - The company is strategically advancing its FCBGA packaging substrate business, with customer expansion proceeding as planned [2] - The CSP packaging substrate business is concentrating on storage and RF markets, while also expanding into the automotive sector [2] Group 2: Product Development - The product structure is gradually shifting towards high value-added and high-priced offerings, particularly in multilayer boards [2]

Core Insights - The PCB industry is experiencing unprecedented growth opportunities driven by the AI wave, with new policies aimed at promoting high-end, green, and intelligent transformation [1] - The demand for AI servers and high-speed networks is significantly boosting the high-end PCB market, with substantial projected growth rates for specific PCB products [1] - The financial performance of PCB companies reflects this market boom, with notable revenue and profit increases across the sector [3][4] Industry Overview - The Ministry of Industry and Information Technology has solicited opinions on a draft regulation to eliminate outdated capacity and encourage technological innovation in the PCB industry [1] - According to Prismark, the market for 18-layer and above high multilayer boards and HDI boards is expected to grow by 40.3% and 18.8% year-on-year in 2024, respectively [1] - The annual compound growth rate for AI server-related HDI from 2023 to 2028 is projected to be 16.3%, marking it as the fastest-growing segment in the AI server PCB market [1] Company Performance - A total of 44 listed PCB companies in A-shares reported a combined revenue of 216.19 billion yuan, a year-on-year increase of 25.36%, and a net profit of 20.86 billion yuan, with a growth rate of 62.15% [3] - Over 75% of these companies reported a year-on-year increase in net profit, with four companies successfully turning losses into profits [3] - Leading company Shengyi Technology saw a remarkable revenue increase of 114.79% and a net profit surge of 497.61% in the first three quarters [3] - Another company, Xingsen Technology, reported over 23% revenue growth and is expanding its production capacity [3] Capital Market Interest - As of the end of Q3, 13 PCB concept stocks were heavily held by QFII, with a total market value of 16.635 billion yuan [4] - Shengyi Technology had a QFII holding ratio of 12.32%, with a market value of 15.936 billion yuan, indicating strong foreign investor confidence [4] - Other companies like Jingwang Electronics and Junya Technology also attracted QFII investments, with notable foreign institutions among their top shareholders [4]

Group 1 - The company, Xingsen Technology, stated on November 12 that its CSP packaging substrates are primarily used in storage chips and RF chips [2] - The customer base includes major South Korean and domestic storage chip clients [2]