Industry Overview - The global PCB industry is expected to continue its recovery trend with structural differentiation, driven primarily by the AI industry [2] - According to Prismark, the global PCB market value is projected to reach $84.891 billion in 2025, representing a year-on-year growth of 15.4% [2] Company Performance - The demand for the company's CSP packaging substrate business remains strong, and the company plans to initiate capacity expansion based on market demand [2] - The company's FCBGA packaging substrate business is progressing steadily in market expansion and customer certification as planned [2] - The total number of shareholders as of February 10, 2026, is over 127,000 [2]

Group 1 - The company, Xingsen Technology, stated that its FCBGA packaging substrates are primarily used in high-performance chip fields such as CPU, GPU, FPGA, and ASIC [2] - The CSP packaging substrates are mainly utilized in storage and RF chip sectors, with an overall production capacity of 50,000 square meters per month [2] - The previous capacity of 35,000 square meters per month has reached full production, and the new expansion of 15,000 square meters per month is progressing rapidly [2] - The overall industry demand is currently strong, and future expansion plans will depend on market demand [2]

Core Viewpoint - The company, Xingsen Technology, is progressing normally in its collaborations with major clients, and the expansion of production capacity is expected to further enhance the scale of its CSP packaging substrate business [2] Group 1 - The company confirmed that its cooperation with major clients is proceeding smoothly [2] - The release of expanded production capacity is anticipated to boost the scale of the CSP packaging substrate business [2]

Group 1 - The company has a current CSP packaging substrate capacity of 50,000 square meters per month, with the previous capacity of 35,000 square meters per month now fully utilized [2] - The company is expanding its capacity by an additional 15,000 square meters per month, and the ramp-up progress is reported to be fast [2] - The overall industry demand is currently good, and future expansion plans will depend on market demand conditions [2]

Core Viewpoint - The company has provided updates on its IC packaging business, specifically regarding capacity utilization rates and expansion plans for its FCBGA production line [1] Group 1: Capacity Utilization - The overall capacity scale for CSP packaging substrates is 50,000 square meters per month, with the original capacity of 35,000 square meters per month now fully utilized [1] - The newly expanded capacity of 15,000 square meters per month is ramping up quickly [1] Group 2: Market Development - The market expansion and customer certification for the FCBGA packaging substrate project are progressing steadily as planned [1] - The company advises stakeholders to monitor its future regular reports for more detailed operational updates [1]

Group 1 - The core viewpoint of the article is that Xingsen Technology's CSP packaging substrate business and its collaboration with key clients in Beijing Xinfai HDI boards and similar carrier boards are progressing normally, despite confidentiality agreements preventing the disclosure of specific client information [2]

Core Viewpoint - The company, Xingsen Technology, is actively expanding its market presence and customer base in the CSP packaging substrate sector, which serves various chip applications [1] Group 1: Company Overview - Xingsen Technology's CSP packaging substrates are utilized in storage chips, application processor chips, sensor chips, and RF chips, indirectly supplying domestic mobile phone manufacturers [1] - The company's Beijing subsidiary, Xinfai, produces Anylayer HDI and similar substrates primarily for high-end smartphone mainboards and sub-boards [1] Group 2: Market Strategy - The company is committed to actively pursuing market expansion and aims to increase its market share and establish benchmark customers [1]

Group 1 - The company, Xingsen Technology, confirmed that cooperation with major clients is progressing normally [2] - The expansion of production capacity is expected to enhance the scale of CSP packaging substrate business [2]

Core Viewpoint - The company, Xingsen Technology, has indicated that its CSP packaging substrate customer base includes major Korean and domestic memory chip clients, with product pricing and gross margins being dependent on specific product structure, size, and processes, making it difficult to generalize [1] Group 1 - The customer base for Xingsen Technology's CSP packaging substrates includes both Korean and domestic major memory chip clients [1] - Product pricing and gross margins are influenced by specific factors such as product structure, size, and manufacturing processes [1] - The company emphasizes that it is not feasible to generalize pricing and gross margin information across all products [1]

Core Viewpoint - The company Xingsen Technology (002436) has confirmed that its CSP packaging substrates are primarily used in storage chips, and its technology and production capacity can meet the demands of downstream customers [1] Group 1 - The main application area for the company's CSP packaging substrates is in storage chips [1] - The company has the technological capabilities to satisfy the needs of its downstream clients [1]