每经AI快讯，有投资者在投资者互动平台提问：公司IC封装业务四季度产能利用率大概是多少， FCGBA产线四季度的大概产能利用率是多少？ 兴森科技（002436.SZ）12月18日在投资者互动平台表示，公司CSP封装基板整体产能规模5万平米/月， 原3.5万平/月产能已满产，新扩1.5万平/月产能爬坡进度较快。FCBGA封装基板项目市场拓展、客户认 证均按计划稳步推进中。公司经营情况请关注后续的定期报告。 （记者 王瀚黎） ...

证券日报网讯 11月27日，兴森科技在互动平台回答投资者提问时表示，公司CSP封装基板业务和北京兴 斐HDI板、类载板业务与原有重要客户的合作均正常推进，具体客户信息因保密协议约定不便披露。 （文章来源：证券日报） ...

证券日报网讯兴森科技（002436）11月25日在互动平台回答投资者提问时表示，公司的CSP封装基板应 用领域涵盖存储芯片、应用处理器芯片、传感器芯片、射频芯片等，在存储芯片、射频芯片等领域间接 供应国内手机厂商；北京兴斐的AnylayerHDI、类载板主要应用于高端智能手机的主板、副板等领域。 公司会积极进行市场拓展，努力拓展标杆客户和市场份额。 ...

证券日报网讯兴森科技11月24日在互动平台回答投资者提问时表示，公司与主要客户的合作均正常推 进，随着扩产产能的释放，CSP封装基板业务的规模有望进一步提升。 （文章来源：证券日报） ...

格隆汇11月24日丨兴森科技(002436.SZ)在投资者互动平台表示，公司CSP封装基板的客户群体包括韩系 和国内存储芯片大客户，产品价格及毛利与具体产品结构、尺寸、工艺等相关，无法一概而论。 ...

Core Viewpoint - The company Xingsen Technology (002436) has confirmed that its CSP packaging substrates are primarily used in storage chips, and its technology and production capacity can meet the demands of downstream customers [1] Group 1 - The main application area for the company's CSP packaging substrates is in storage chips [1] - The company has the technological capabilities to satisfy the needs of its downstream clients [1]

Core Viewpoint - The company, Xingsen Technology, is experiencing a recovery in the downstream storage chip sector, leading to a full order book for its CSP packaging substrates, indicating a positive market outlook [1] Group 1: Company Operations - The application fields of the company's chip products are determined by customer needs, with specific customer information kept confidential due to non-disclosure agreements [1] - The FCBGA packaging substrate project is currently in small-batch production, with market expansion and customer certification progressing as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]

Core Viewpoint - The company indicates that the application fields of its chip products are determined by customer needs, with specific customer information being confidential due to non-disclosure agreements [1] Group 1: Company Performance - The company reports a full order book for CSP packaging substrates due to the recovery in the downstream storage chip sector, suggesting that overall market conditions are expected to remain favorable [1] - The FCBGA packaging substrate project is currently in the small-batch production stage, with market expansion and customer certification progressing as planned [1] Group 2: Market Dynamics - The timeline for mass production of the FCBGA project primarily depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]

Core Viewpoint - The company, Xingsen Technology, has confirmed that one of the main application areas for its CSP packaging substrates is storage chips, indicating that its technology and production capacity can meet downstream customer demands [1]. Group 1 - The company specializes in CSP packaging substrates [1] - The primary application area for the company's products is in storage chips [1] - The company's technology and production capacity are aligned with the needs of downstream customers [1]

Core Viewpoint - The company, Xingsen Technology, is focusing on the development of IC packaging substrates, which are essential materials for chip packaging, targeting various sectors including CPU, GPU, FPGA, ASIC, and storage chips [2] Group 1: Business Focus - The company is strategically advancing its FCBGA packaging substrate business, with customer expansion proceeding as planned [2] - The CSP packaging substrate business is concentrating on storage and RF markets, while also expanding into the automotive sector [2] Group 2: Product Development - The product structure is gradually shifting towards high value-added and high-priced offerings, particularly in multilayer boards [2]