Summary of Conference Call Records Industry Overview - The BT substrate industry is nearing full production capacity with utilization rates exceeding 90% as of 2026, driven primarily by demand from automotive electronics, power chips, and AI server applications [1][2] - The supply-demand balance for ABF substrates is improving, but a structural gap remains for high-end products, particularly those with over 20 layers [1][2] Key Insights and Arguments - **Demand Drivers**: The main growth drivers for BT substrates in 2026 are automotive electronics and power-related chips, with AI-related demands also contributing, especially in power management and auxiliary chip segments [3] - **High-End Product Shortages**: High-end ABF substrates, particularly for FPGA and AI servers, are still in short supply due to yield bottlenecks, with domestic manufacturers facing cost disadvantages [1][4] - **Market Dynamics**: The market for BT substrates is relatively stable with many participants, while ABF substrates have seen more volatility in utilization rates, particularly in 2022 and 2023 [2] - **Production Capacity**: Key equipment delivery times for exposure machines have decreased from 2-3 years during peak demand to about 1 year, alleviating constraints on capacity release for 2025-2026 [1][5] Additional Important Points - **Material Dependency**: Core materials such as ABF films and solder mask materials are still heavily reliant on Japanese suppliers, with domestic manufacturers facing technical bottlenecks in fine line adhesion and reliability verification [1][17] - **New Market Entrants**: The barriers to entry for BT substrates are lower compared to ABF substrates, primarily due to the similarity in materials and processes to PCB manufacturing. However, gaining market acceptance remains a significant challenge [6] - **Technological Advancements**: The industry is observing a shift towards glass substrates as a potential replacement for organic substrates due to their advantages in warpage control, although mass production remains a challenge [1][14] - **Power Management Modules**: The integration of power management modules into AI servers is becoming critical, with domestic manufacturers capturing a significant market share in this area [1][8][11] Supply Chain and Material Procurement - **Supplier Relationships**: The supply chain is characterized by strong relationships between major customers and large substrate manufacturers, with overseas suppliers dominating the market due to their superior technology and yield performance [11][18] - **Price Dynamics**: Price changes for ABF and BT substrates are primarily driven by fluctuations in raw material costs rather than supply-demand dynamics, as customer relationships tend to be stable [18][20] Future Outlook - **Market Growth**: The demand for storage-related BT substrates is expected to improve, driven by AI applications, leading to increased pricing and profit margins in this segment [19][20] - **Technological Challenges**: The industry faces challenges in achieving higher density and integration levels, particularly with the transition to vertical power delivery systems and embedded capacitors [15][16]