（文章来源：每日经济新闻） （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：公司ABF载板关键客户认证与导入速度是否低于预期？ 高端产能的闲置会影响今年的财报吗？ 兴森科技（002436.SZ）12月31日在投资者互动平台表示，公司FCBGA封装基板项目市场拓展、客户认 证均按计划稳步推进中，公司经营情况请关注后续定期报告。 每经AI快讯，有投资者在投资者互动平台提问：公司ABF载板关键客户认证与导入速度是否低于预期？ 高端产能的闲置会影响今年的财报吗？ 兴森科技（002436.SZ）12月31日在投资者互动平台表示，公司FCBGA封装基板项目市场拓展、客户认 证均按计划稳步推进中，公司经营情况请关注后续定期报告。 ...

来源：综合整理 与您一路同行，做您最忠实的拥护者--PCB行业融合新媒体-2025年最有价值的电路板产业服务平台！欢迎您的关注与点赞！祝您事业有成！平安喜乐！ 欣兴加码资本支出逾60亿新台币，联电大股东低价参与增资 为应对大型云端服务提供商（CSP）客户订单持续增长，台湾载板大厂欣兴（3037.TW）于12月16日宣布调整资本支出规划。公司董事会决议将2026年度 资本预算由原先194亿新台币，追加60亿新台币，提升至约254亿新台币（约合56.7亿人民币），增幅达30.93％，规模已高于今年水准。同时，董事会核准 2027年长交期设备预下订单金额约25亿新台币（约合5.6亿人民币）。 图片来源：企业官网 欣兴表示，此次资本支出调整主要为配合营运需求，新建厂房并提升制程能力，资金来源包括自有资金及银行融资。未来资本预算及长交期设备采购执行 进度，将视客户需求及市场状况弹性调整，实际支付金额则依执行进度与付款条件而定。 在产能布局方面，欣兴目前已成为全球四大CSP的载板主要供应商，并已完成AI ASIC与GPU两大客户线的产能布局与认证卡位。现阶段产能几乎被客户 全数锁定，今年第四季度稼动率已升至高档。公司预期 ...

格隆汇12月10日丨兴森科技(002436.SZ)在互动平台表示，公司BT载板整体产能规模5万平米/月，原3.5 万平/月产能已满产，新扩1.5万平/月产能处于量产爬坡阶段；ABF载板目前处于小批量生产阶段。 ...

（记者 胡玲） 兴森科技（002436.SZ）12月10日在投资者互动平台表示，公司BT载板整体产能规模5万平米/月，原3.5 万平/月产能已满产，新扩1.5万平/月产能处于量产爬坡阶段；ABF载板目前处于小批量生产阶段。 每经AI快讯，有投资者在投资者互动平台提问：请问公司规模量产的是BT载板？还是ABF载板？以哪 种为主？ ...

Core Viewpoint - Zhongtian Jingzhuang (002989) announced that its affiliated company, Keri Semiconductor Technology (Dongyang) Co., Ltd., produces ABF substrate products that can be used for TPU chip packaging [1] Group 1 - Zhongtian Jingzhuang responded to investor inquiries on an interactive platform [1] - The main business of Keri Semiconductor Technology involves ABF substrate products [1] - ABF substrates are applicable in the packaging of TPU chips [1]

Group 1 - The article emphasizes the importance of timely and professional information interpretation in investment decision-making [1] - It highlights the launch of OCS optical switches utilizing all-optical switching technology, with ongoing development of domestic computing power supernodes and integrated training and reasoning machines [1] - The article mentions the completion of final testing and preliminary research for the second and third generation products of HBM storage chips, along with investments in ABF substrate companies and the establishment of a semiconductor packaging and testing equipment subsidiary [1]

Group 1 - The core focus of Zhongtian Jingzhuang's invested company, Shenzhen Yuanjian Zhichun Technology Co., Ltd., is on high bandwidth memory (HBM) chips, with HBM2/2e products completing final testing and moving towards mass production and upgrades [1][2] - HBM3/3e products are currently in the research and development phase, having completed preliminary research and some design work [1][2] - Another invested company, Kuiruisi Semiconductor Technology (Dongyang) Co., Ltd., specializes in ABF substrate-related businesses, with products used for packaging high-performance chips such as CPUs, GPUs, AI, and automotive applications, and the first phase of the project has been successfully put into production [1][2] Group 2 - Hefei Xinfeng Technology Co., Ltd., another invested company, focuses on the packaging and testing of storage chips, providing integrated packaging and testing services to clients [1][2]

Core Viewpoint - The company has significant investments in enterprises focusing on high bandwidth memory (HBM) technology, with ongoing developments in HBM2/2e and HBM3/3e products [1] Group 1: HBM Technology - The company's invested enterprise, Shenzhen Yuanjian Zhichun Technology Co., Ltd., is concentrating on the HBM sector, with HBM2/2e products having completed final testing and moving towards mass production and upgrades [1] - HBM3/3e products are currently in the research and development phase, having completed preliminary research and some design work [1] Group 2: Semiconductor Packaging - The company's invested enterprise, Coreis Semiconductor Technology (Dongyang) Co., Ltd., specializes in ABF substrate-related businesses, with products used for packaging high-performance chips such as CPU, GPU, AI, and automotive applications [1] - The first phase of the project has been put into production, and current progress is reported to be smooth [1] Group 3: Testing and Packaging Services - The company's invested enterprise, Hefei Xinfeng Technology Co., Ltd., focuses on the packaging and testing of memory chips, providing integrated packaging and testing services to clients [1]

Core Viewpoint - The semiconductor industry is facing a critical shortage of essential raw materials, which poses a significant risk to the growth and stability of the trillion-dollar sector. This shortage is driven by geopolitical tensions, increased demand from AI and other technologies, and supply chain disruptions [4][5][24]. Group 1: Current Material Shortages - The semiconductor industry is experiencing a collective shortage of multiple raw materials, including gallium, indium phosphide, germanium, tungsten hexafluoride, and high-purity silicon, which are crucial for chip manufacturing [5][6]. - Gallium prices have surged over 40% in Europe due to export controls from China, leading to extended delivery times and reduced inventory at chip manufacturers [8][9]. - Indium phosphide is in severe shortage due to skyrocketing demand from AI applications, with some buyers willing to pay any price for available supplies [10][12]. Group 2: Price Increases and Supply Chain Impact - Germanium prices reached a 14-year high, with a price increase of over 350% since early 2023, driven by supply constraints and surging demand from low-orbit satellites and AI computing [13]. - Tungsten hexafluoride prices are expected to rise by 70% to 90% due to increased tungsten prices, which have doubled since early 2023, impacting chip manufacturing costs significantly [14][15]. - The shortage of high-end PCB materials, driven by a 50% year-on-year increase in demand for AI servers, is causing supply constraints for advanced chip packaging [16][17]. Group 3: Geopolitical and Policy Influences - The global semiconductor materials shortage is exacerbated by national security policies, with countries implementing export controls and strategic reserves to secure their supply chains [19][20]. - The U.S. is heavily reliant on China for gallium, with domestic production capabilities limited, leading to increased efforts to develop recycling technologies to mitigate shortages [8][9][19]. - China's export restrictions on key metals have led to a significant reduction in global supply, prompting other nations to seek self-sufficiency in critical materials [19][23]. Group 4: Long-term Industry Implications - The ongoing material shortages are likely to extend the technology iteration cycle in the semiconductor industry, delaying advancements in chip manufacturing and product releases [22]. - The shift towards regional self-sufficiency in semiconductor materials may lead to a bifurcation of the global supply chain, with a clear divide between China-led and U.S.-led technology ecosystems [23][24]. - The semiconductor industry's future will require a focus on resource management and innovation in recycling and alternative materials to address the challenges posed by limited raw materials [24][25].

Group 1 - Strong demand for AI is driving price increases in the semiconductor supply chain, particularly affecting passive components and copper foil substrates [1] - The PCB supply chain has experienced a supply-demand imbalance since the second half of this year, exacerbated by NVIDIA's significant resource absorption [1] - High demand for T-Glass fiberglass is leading to severe shortages in Q4, while copper foil substrates are expected to see a supply gap due to necessary upgrades in signal integrity standards [1] Group 2 - Goldman Sachs predicts that prices for non-NVIDIA ABF substrates will increase by 5% to 10% each quarter from Q4 2023 to Q4 2026, with BT substrates also experiencing significant price hikes [1] - The passive component industry may face tightening supply conditions by 2026, prompting major Taiwanese passive component manufacturers like Yageo to raise tantalum capacitor prices starting in November [1]