Core Viewpoint - The article emphasizes the need for innovation in the EDA industry to address the increasing complexity of chips and the challenges in system integration, particularly in the context of the current US-China competitive relationship [1][3]. Group 1: Company Overview - Julin Technology, founded in 2019, focuses on providing EDA simulation and verification solutions from chip design to packaging and system integration [3][4]. - The company's core product, the SIDesigner signal integrity simulation platform, has been successfully commercialized with Huawei in 2024, addressing critical pain points in high-precision SI transient simulation and enabling future ultra-high-speed SerDes and DDR5 design [3][4]. Group 2: Industry Challenges and Solutions - The EDA industry faces three key hurdles: creating products that customers are willing to pay for, achieving annual sales of over 10 million for a single product at a single client, and ultimately reaching 30 million in annual sales for a single product [4][5]. - Julin Technology aims to solve two major challenges related to electricity in the EDA industry: circuit issues and electromagnetic problems, which are considered the driving forces of the industry [6]. Group 3: Product Offerings - The company has developed three core products based on its TRUE-SPICE simulator: - SIDesigner, a comprehensive system-level SI/PI simulation platform - HobbSim, a batch signal integrity time-domain simulation platform - PowerExpert, a mixed-signal power electronic system design and simulation tool [7][8]. Group 4: Strategic Approach - The company prioritizes securing head clients to build trust and credibility before expanding to mid-tier and smaller clients, reflecting confidence in its technology and team [9]. - Julin Technology's team, consisting of over 70 members, emphasizes a commitment to technical excellence and rapid problem-solving for clients [9]. Group 5: Future Goals - The company plans to launch the alpha version of its EMArtist product by the end of this year, with a full release expected in the first half of next year, aiming to address all circuit and electromagnetic simulation issues related to 3DIC by 2028 [10].