格隆汇11月27日丨振华风光(688439.SH)在投资者互动平台表示，公司系统封装（SiP）技术聚焦信号调 理、电机驱动等方向，已成功开发旋变解码驱动、三相桥驱动控制器等系列产品，其中旋变解码驱动新 品封装尺寸为6mm×6mm，具备角度解码与激励驱动特性，解码分辨率达16位。在微系统集成封装方 面，公司攻克了"有机+金属SiP结合""RDL+TSV技术"等核心工艺，并掌握三维多基板堆叠封装技术、 2.5D硅转接板设计技术。公司针对高密度SiP产品的封装能力，已开发包含RDL布线设计、倒装芯片与 键合芯片堆叠集成封装等方案，支撑高集成度微系统项目研制。 SiP技术的竞争优势主要体现在： 小型 化与高密度集成：通过多芯片堆叠和异构集成，显著缩小产品尺寸（如6mm×6mm封装），提升系统集 成度，满足装备轻量化需求；性能优化：缩短信号传输路径，降低功耗与延迟，增强系统可靠性，适用 于高可靠领域极端环境；技术壁垒：公司掌握三维多基板堆叠封装、高速信号完整性仿真等核心技术， 支撑国产化系统级解决方案。 ...

Core Viewpoint - The company, Zhenhua Fengguang, focuses on System in Package (SiP) technology, successfully developing a series of products aimed at signal processing and motor drive applications, highlighting its competitive advantages in miniaturization and high-density integration [1] Group 1: Product Development - The company has developed new products such as the rotary variable differential transformer (RVDT) decoder driver and three-phase bridge driver controllers, with the RVDT decoder driver featuring a package size of 6mm×6mm and a decoding resolution of 16 bits [1] - The company has overcome key processes in micro-system integrated packaging, including the combination of organic and metal SiP, RDL and TSV technologies, and has mastered 3D multi-board stacking packaging technology and 2.5D silicon interposer design technology [1] Group 2: Competitive Advantages - The competitive advantages of SiP technology include significant size reduction and high-density integration through multi-chip stacking and heterogeneous integration, meeting the lightweight requirements of equipment [1] - Performance optimization is achieved by shortening signal transmission paths, reducing power consumption and latency, and enhancing system reliability, making it suitable for high-reliability applications in extreme environments [1] - The company has established technical barriers by mastering core technologies such as 3D multi-board stacking packaging and high-speed signal integrity simulation, supporting domestic system-level solutions [1]