Core Insights - The article highlights the successful development of a high-performance computing (HPC) system-on-chip (SoC) by 联咏, based on Arm Neoverse CSS N2 architecture, marking a significant milestone for the company in entering the data center, AI cloud, and automotive computing markets [1][3] Group 1: Product Development - The SoC utilizes a "Chiplet" heterogeneous integration architecture, incorporating Neoverse N2 computing cores, DDR5 and HBM3e memory controllers, PCIe 6.0/CXL 2.0 interfaces, and 224G SerDes high-speed transmission modules, enabling a modular design [2] - The SoC is manufactured using TSMC's N4P advanced process and CoWoS advanced packaging, demonstrating 联咏's long-term commitment to high-performance, low-power computing and its capabilities in AI ASIC and Chiplet design services [2] Group 2: Market Position and Growth Potential - Industry insiders note that 联咏's successful transition from consumer ICs to server and ASIC chip development positions it well for entering the AI hardware infrastructure market, with AI server and edge computing demands expected to drive new growth [2][3] - The successful tape-out of the SoC validates 联咏's capabilities in advanced process ASIC integration, laying the groundwork for future developments in cloud AI, automotive autonomous driving, and edge server applications [3] - Analysts are optimistic about the growth potential of 联咏's ASIC business, anticipating an increase in revenue contribution from AI servers and automotive electronics, reinforcing the company's strategic positioning in the high-performance computing market [3]