联发科的员工分红总金额与当期获利表现连动，大致是以公司税前盈余提拨一定比率发放，外界推 估比率约在二成左右。 IC设计大厂联发科2025年下半年的员工分红，预计将于今年2月底发放。外界估算，这次该公司分 红总金额约114亿元，大约比去年8月底发放2025年上半年分红减少15.7％。以该公司有资格参与 分红的员工约1.2万人估算，平均每人约可分得95万多元。 联发科每年的员工分红共分两次发放，上半年度分红是于同年8月发放，下半年度分红则是于隔年 2月发放。联发科对外界推估的员工分红数字向来不予评论。 据了解，虽然此次联发科员工分红平均每人约可分得超过95万元，惟每人实际可分得的金额，会 根据部门、职级、考绩等条件而有所不同。近日市场上流传该公司这次所领员工分红的数字，在工 程师E7职等中，有人所领分红为半个月薪资，有人则达六个月薪资，副理E9职等则有人分红可获 上百万元，差异甚大。 | | 지적 | | --- | --- | | ケア 17 21 | · 去年下半年的員工分紅·預計將於今年2月底發 収 | | | · 去年下半年視前盈餘約571.07億元,比去年上半 | | | 年視前盈餘677.81億元減少 ...

联发科是中国台湾IC设计龙头，也是全球第五大IC设计厂，其员工薪酬水准长年保持在台湾上市柜公司 的前段班。依照该公司申报的2024年非主管职全时员工薪资，全年薪资平均数为431万元新台币，中位 数为343.8万元新台币，在上市柜公司中都仅次于股王信骅，也都比该公司2023年的数字增加。 另外，为与员工共享公司长期营运成果，联发科自2023年起于中国台湾导入集团员工持股补助计划，员 工可自每月薪资提拨一定金额，并偕同公司补助金一同参与购买联发科股票。 联发科去年下半年税前盈余约571亿元新台币，比去年上半年税前盈余677.8亿元新台币减少15.7％，外 界推算今年2月底发放的去年下半年员工分红约为114.2亿元新台币，以共约1.2万名员工符合领取资格来 估算，平均每人约可领95.1万元新台币。 外界认为，由于参与联发科员工分红者还包括公司的初中高阶主管，因此分红总金额可反映出该公司员 工每期所获合计分红数字的起伏变化，但分红平均数与个别员工所获金额可能有差异。 IC设计大厂联发科（2454） 2025年下半年的员工分红，预计将于今年2月底发放。外界估算，这次该公 司分红总金额约114亿元新台币，大约比去年8月底 ...

Group 1 - The semiconductor industry is expected to experience a new wave of price increases, with IC design firms like MediaTek indicating plans to adjust prices in response to rising costs [1] - The price increase trend in the IC design sector is anticipated to become clearer after the Lunar New Year, with power management ICs likely being the first to see successful price hikes [1] - MediaTek's CEO has expressed optimism for the company's growth this year, stating that they will strategically adjust prices and allocate production capacity to reflect rising manufacturing costs [1] Group 2 - The rising prices of metals and the increased costs from packaging and testing firms are driving the need for IC design companies to raise prices to maintain profit margins [1] - Major packaging and testing companies, such as ASE and ChipMOS, have already raised their prices by up to 20% due to severe supply shortages in semiconductor packaging and testing capacity [1] - In the wafer foundry sector, companies like SMIC have raised some capacity prices by approximately 10%, while other Taiwanese firms are also adjusting their prices in both advanced and mature processes [2]

1. Report Industry Investment Rating No relevant content provided. 2. Core Viewpoints of the Report - In the week of January 19 - 23, the stock market had large - scale net outflows of funds from important index ETFs, but the main indices were still oscillating strongly. The bond market was affected by regulatory news and the central bank's actions, with the 10 - year Treasury bond rate falling. The convertible bond market generally rose, with the CSI Convertible Bond Index up 2.92% [1][7][8]. - In the context of strong equity market sentiment and tight supply - demand of convertible bonds, the convertible bond market continued to rise last week, with the CSI Convertible Bond Index hitting a new high in nearly 10 years. It is recommended to avoid the risks of individual bonds with high redemption pressure and limited upward driving force of the underlying stocks [2][17]. - Looking forward, although the valuation vulnerability of the convertible bond market has further increased, the upward trend of the equity market is clear, providing support for convertible bond valuation. In the coming week, it is advisable to focus on sectors with high performance certainty and low - valuation leading stocks in under - performing industries [3][18]. 3. Summary by Relevant Catalogs 3.1 Market Focus (January 19 - 23) - **Stock Market**: There were large - scale net outflows of funds from important index ETFs, but the main indices were oscillating strongly with daily trading volume above 2.5 trillion yuan. The "15th Five - Year Plan" for power grid investment boosted the power grid equipment sector, and precious metals rose significantly due to global geopolitical situations. Different sectors showed fragmented performance on different days, and most Shenwan primary industries rose, with building materials, petroleum and petrochemicals, etc. leading the gains, while banks, communication, etc. lagging behind [1][7][8]. - **Bond Market**: The economic data announced last week was in line with expectations. The mid - week capital situation was tight but improved after the central bank's intervention. News of regulatory intention to cool the equity market was favorable for the bond market sentiment. The 10 - year Treasury bond rate closed at 1.8298% on Friday, down 1.26bp from the previous week [1][7][8]. - **Convertible Bond Market**: Most convertible bond individual securities rose. The CSI Convertible Bond Index was up 2.92% for the week, the median price was up 3.01%, and the arithmetic average parity was up 3.66%. The overall conversion premium rate decreased by 0.96% compared with the previous week. The textile and clothing, steel, and petroleum and petrochemical sectors in the convertible bond market led the gains, while social services, media, etc. lagged behind. In terms of individual bonds, Jiamei, Fuxin, etc. had the top gains, while Dongshi, Yinbang, etc. had the top losses. The total trading volume of the convertible bond market last week was 4395.97 billion yuan, with an average daily trading volume of 879.19 billion yuan, a decrease from the previous week [1][8][12]. 3.2 Views and Strategies (January 26 - 30) - **Risk Avoidance**: Strengthen the expected management of individual bond redemptions. Due to the "unexpected redemptions" of some targets at the beginning of the week, the valuation of high - parity convertible bonds was compressed. It is recommended to avoid the risks of individual bonds with high redemption pressure and limited upward driving force of the underlying stocks by considering factors such as remaining term and short - term stock price demands [2][17]. - **Investment Suggestions**: Although the valuation vulnerability of the convertible bond market has increased, the upward trend of the equity market provides support for convertible bond valuation. In the week of January 26 - 30, it is advisable to focus on sectors with high performance certainty such as semiconductor equipment and materials, chemical industry, lithium battery, CXO, etc., and low - valuation leading stocks in under - performing industries for absolute return funds [3][18]. 3.3 Valuation Overview - As of January 23, the average conversion premium rates of equity - biased convertible bonds in different price ranges were at high percentile values since 2010 and 2021. The average YTM of debt - biased convertible bonds with a parity below 70 yuan was - 5.66%, at the 0%/1% percentile since 2010 and 2021. The average implied volatility of all convertible bonds and the difference between the implied volatility and the long - term actual volatility of the underlying stocks were also at high percentile values [19]. 3.4 Primary Market Tracking - **Last Week (January 19 - 23)**: Aiwei and Longjian convertible bonds announced their issuance, and no convertible bonds were listed. Aiwei Convertible Bond has a scale of 19.01 billion yuan, and Longjian Convertible Bond has a scale of 10 billion yuan [26][27]. - **Next Week (January 26 - 30)**: No convertible bonds are announced for issuance, and Lianrui Convertible Bond will be listed, with a scale of 6.95 billion yuan [28][29]. - **Overall Situation**: As of January 23, there were 97 convertible bonds to be issued, with a total scale of 1522.3 billion yuan, including 8 that have been approved for registration, with a total scale of 61.6 billion yuan [30].

Financing Overview - From January 12 to January 18, Shanghai enterprises experienced 24 financing events, with 15 disclosing financing amounts, totaling 2.8485 billion yuan [2] - The number of financing events remained the same as the previous week, with the highest number occurring in the Pudong New Area, which had 7 events [2] Artificial Intelligence - SenseTime Medical completed nearly 100 million yuan in strategic financing on January 12, with investment from Henan Huirong Fund [4] - Wuzhitai Technology, a robot leasing platform, secured several tens of millions in Pre-A round financing on January 15, with investments from Lion City Capital, Baidu Investment, and existing shareholder Jingya Capital [5] - Qingtian Rental, another robot leasing platform, completed seed round financing on January 15, led by Hillhouse Venture Capital and supported by several other investors [6] - Futuring Robotics, focusing on dual-arm household service robots, raised 200 million yuan in angel round financing on January 12, with investments from ZhenFund, Yuanlai Capital, and Lianxin Capital [7] Integrated Circuits - Zhanwang Technology, an IC design company, completed 100 million yuan in angel round financing on January 14, led by Zijin Port Investment and金沙江联合资本 [8] - Lijiao Technology, specializing in semiconductor RF and plasma systems, completed Pre-A+ round financing on January 14, with investments from Shangrong Capital, Zhongbi Fund, and Shanghai Dingyu [9] - Yunshen Technology, focusing on semiconductor materials and equipment, completed A round financing on January 14, with investment from Yida Capital [10] Biomedicine - Yuanqi Bio, specializing in tumor immunotherapy, completed 70 million USD in C round financing on January 12, led by Beijing Pharmaceutical Health Industry Investment Fund and QIA [11] - Fanfang Medical, focusing on medical devices, completed angel round financing on January 12, with investment from Tianshi Innovation Capital [12] - Ailios, specializing in pharmaceutical process filtration, completed over 100 million yuan in Pre-B round financing on January 15, led by Guotou Chuanghe [13] - Xinyao Paike, focusing on drug packaging materials and medical devices, completed 100 million yuan in B+ round financing on January 15, led by Guangfa Xinde [14] - Shengshengji, specializing in precision intelligent health technology, completed several tens of millions in angel financing on January 15 [15] Future Industries - Shuli Innovation, focusing on brain-machine interfaces, completed several hundred million yuan in B+ round financing on January 16, with investments from the National SME Development Fund and Dongfang Fuhai [16] - Jinghai Weixiang, specializing in synthetic biology, completed nearly 100 million yuan in B round financing on January 12, with investment from Jiazhizhi Fund [17] - Huanliang Technology, focusing on AI new materials, completed strategic financing on January 13, with investment from Qicai Chemical [18] - Jingxiang Technology, specializing in flexible tactile sensors, completed angel round financing on January 14, with investments from Zhongke Chuangxing and Pudong Fund [19] - Xinhang Micro, focusing on vacuum components, completed several tens of millions in angel round financing on January 12, with investments from Yushan Capital and Daohua Investment [20] - Youji Technology, specializing in machine tool intelligence, completed B round financing on January 14, with investment from Changyingxin Investment [21] - Xinghuan Juneng, focusing on fusion energy commercialization, completed 1 billion yuan in A round financing on January 12, with investments from multiple institutions [22] - Chaomagnet New Energy, specializing in high-temperature superconducting strong field magnets, completed several hundred million yuan in angel round financing on January 16, led by Dingfeng Chuangke [23]

Group 1 - MediaTek aims to capture a significant share of the WiFi chip market, with a projected market opportunity of $11 billion for WiFi 7 chips, expecting a penetration rate increase from 15% last year to 30% this year [1] - The company plans to launch its next-generation WiFi 8 chip, utilizing a 6nm process, with mass production expected to begin in Q4 of this year, which will further enhance its market position [1] - MediaTek's WiFi 7 chip currently holds over 30% market share, with an estimated demand for 4 billion devices to upgrade, indicating strong growth potential in the WiFi market [1] Group 2 - MediaTek is not affected by the rising prices of DRAM, as the cost increase is absorbed by chip customers, and the company will continue to use DDR4 DRAM with its WiFi chips in the short term [2] - The demand for high-reliability connections is at an unprecedented peak, driven by the rapid growth of AI and low-latency applications [2]

Core Viewpoint - The Taiwanese authorities announced the "Advanced Development Subsidy Program for IC Designers" for 2026, prioritizing support for IC designers in developing chips for drones, robots, and satellite communications to maintain Taiwan's critical position in the global semiconductor industry [1]. Group 1: Subsidy Program Overview - The total budget for this subsidy program in 2023 is set at NT$1.75 billion, with a duration of no more than three years [2]. - The subsidies are divided into two categories: - The first category focuses on "advantageous chip" development, allowing single applications with a maximum subsidy of NT$200 million, targeting innovative chips that address industry technology gaps or market demands, particularly in drones, robots, and satellite communications [2]. - The second category is for "core chip and system development," which allows joint applications with a maximum subsidy of NT$300 million, aimed at developing high-value core chips and modules/systems in collaboration with local system operators [2]. Group 2: Targeted Chip Types and Specifications - The program specifies the types and specifications of chips eligible for subsidies, including: - Communication chips for the drone sector - Composite sensing and control chips for the robotics sector - Ku band RF chips for the satellite communications sector [2].

Market Overview - The Shanghai Composite Index has stabilized above the 60-day moving average, indicating a continuation of the upward trend in the market. Other major indices such as the ChiNext Index, Shenzhen Component Index, and CSI 500 have also surpassed the 60-day moving average, showing a clear strengthening of the market. The year-end cautious sentiment is gradually dissipating, and the selling wave under the "locking in profits" sentiment has come to a pause, signaling the beginning of a year-end rally in A-shares [1] Future Outlook - December's uncertainties are largely resolved, setting the stage for the spring market in the coming year. Key uncertainties include the Federal Reserve's interest rate decision, inflation, employment data releases, and the latest interest rate decision from the Bank of Japan. Current indications from officials of the Federal Reserve and the Bank of Japan are neutral to dovish, alleviating the tight liquidity environment in global financial markets at year-end, which had previously constrained the upward movement of A-shares. After a prolonged period of sideways movement since October, the market is now positioned for further upward expansion. A recovery in supply and demand in the mid-to-lower reaches of the manufacturing sector is likely in 2026, which could lead to a significant rebound in the earnings growth of A-share listed companies. The current market fluctuations may be preparing for a new level in the index as 2025 comes to a close, making it an ideal time to prepare for the upcoming spring market [1] Sector Focus - In December, sectors benefiting from dividends and price increases are expected to outperform, with short-term attention on banks, public utilities, coal, and non-ferrous metals. Consumer sectors may also gain attention due to event-driven factors. In 2026, technology remains the market's main focus, with particular attention on AI, lithium batteries, military industry, and robotics after a phase of adjustment. Key points of interest include: 1. The trend in AI hardware remains established, with a continuous increase in the token usage of major AI models, indicating a peak in AI applications expected in 2026. 2. The domestic production of robots and their integration into daily life is a confirmed trend for 2026, with robot products expanding from humanoid robots to quadrupedal and functional robots, creating recurring opportunities in sensors, controllers, and dexterous hands. 3. The trend towards semiconductor localization continues, with a focus on semiconductor equipment, wafer manufacturing, semiconductor materials, and IC design. 4. The military industry is expected to see a continued recovery in orders in 2026, with many sub-sectors like ground equipment, aviation equipment, and military electronics showing signs of bottoming out in their third-quarter performance. 5. The innovative drug sector is entering a harvest period after nearly four years of adjustment, with positive net profit growth for four consecutive quarters since Q3 2024, and an anticipated turning point in fundamentals in 2025, continuing an upward trend into 2026 [2]

Core Viewpoint - Company is pursuing a dual listing in Hong Kong and A-share markets to enhance its international strategy and financing capabilities [1][3] Group 1: Company Overview - Company, formerly known as Weir Shares, rebranded to Howie Group on June 11, 2023 [2][5] - Founded in 2007 by chip tycoon Yu Renrong, Howie Group is recognized as one of the top three image sensor suppliers globally, alongside Sony and Samsung [2][5] - The company focuses on three main product lines: image sensor solutions, display solutions, and analog solutions, while expanding its product offerings to serve high-growth sectors such as smartphones, automotive, medical, security, and emerging markets like machine vision and AI [2][5][6] Group 2: Financial Performance - According to the prospectus, the company's revenue for 2022, 2023, and 2024 is projected to be 20.04 billion, 20.98 billion, and 25.71 billion yuan respectively [6] - For the first nine months of 2025, the company reported revenue of 21.78 billion yuan, a year-on-year increase of 15.2%, with a net profit of 3.21 billion yuan, up 35% [3][6] - The company aims to enhance its overall competitiveness through this listing, focusing on international expansion and overseas business development [3][6]

Group 1 - The company views mergers and acquisitions as one of its development strategies aimed at enhancing its technological and market competitiveness [1] - The goal of the company is to become a relatively large-scale integrated circuit (IC) design company through these mergers and acquisitions [1]