Group 1 - The core viewpoint of the articles highlights the increasing demand for AI-driven advanced packaging and testing in the semiconductor industry, with significant investments being made to meet this demand [1][2] - The global packaging leader, ASE Technology Holding Co., is investing NT$17.6 billion (approximately US$576 million) in a new facility in Kaohsiung, expected to be completed in Q1 2028, creating nearly 2,000 job opportunities [1] - ASE's revenue forecast for advanced packaging and testing is projected to increase from US$600 million in 2024 to US$1.6 billion (approximately NT$48.63 billion) by 2028, with advanced packaging accounting for about 75% of this revenue [1] Group 2 - According to Yole Group's latest report, the advanced packaging market is expected to reach approximately US$46 billion in 2024, growing at a rate of 19% annually, and is projected to reach US$79.4 billion by 2030 [2] - The demand for advanced packaging technologies such as fan-out architectures, System-in-Package (SiP), Flip Chip Ball Grid Array (FC-BGA), and advanced substrates is increasing due to the influence of AI and High-Performance Computing (HPC) [2]