证券日报网讯 12月29日，通富微电在互动平台回答投资者提问时表示，公司的对外投资，均围绕封测 主业以及相关上下游产业链，具有较强的产业逻辑；对外投资项目将按照信息披露要求履行信披义务。 （编辑 丛可心） ...

（记者 王晓波） 每经AI快讯，有投资者在投资者互动平台提问：请问深科技目前关于存储这块的产能利用率是多少？ 深科技（000021.SZ）12月26日在投资者互动平台表示，公司目前深圳、合肥封测处于满产状态，并根 据客户近期需求在扩产，产能利用率良好。 ...

（文章来源：证券日报） 证券日报网讯 12月24日，蓝箭电子在互动平台回答投资者提问时表示，公司具备覆盖4英寸-12英寸晶 圆全流程封测能力，可覆盖消费电子、汽车电子、工业控制等多领域芯片的封装测试需求；公司已形成 超过190亿只的年生产规模，实际产量将结合市场订单需求、产能利用率等因素动态调整。 ...

（文章来源：每日经济新闻） 到月产2万片，更多情况请关注我司后续相关信息披露。 每经AI快讯，有投资者在投资者互动平台提问：子公司日月同芯按月产2万片测算，预估年产值多少？ 同兴达（002845.SZ）12月19日在投资者互动平台表示，目前日月同芯封测项目产能释放顺利，即将达 ...

证券日报网讯12月18日，长电科技（600584）在互动平台回答投资者提问时表示，公司的封测服务覆盖 DRAM、Flash等各种存储芯片产品，拥有20多年存储封装量产经验，存储相关封测技术处于行业领先 的地位。公司将持续加强先进封装在存储领域的发展。 ...

证券日报网讯12月17日，长电科技（600584）在互动平台回答投资者提问时表示，股价波动受多重因素 影响。公司目前处于加速向先进封装转型的阶段，固定资本开支力度和研发投入强度均大幅超过封测行 业主要公司。 ...

证券日报网讯 12月15日，长电科技在互动平台回答投资者提问时表示，股价波动受多重因素影响。公 司注重投资者回报，持续优化利润分配方案，增加分红频次，通过稳定的现金分红回馈股东。公司目前 处于加速向先进封装转型的阶段，固定资本开支力度和研发投入强度均大幅超过封测行业主要公司。初 期这些投入转化为业绩需要一定的时间，相信未来几年随着先进产品地大量导入，盈利能力会得到逐步 的释放。 （文章来源：证券日报） ...

Core Viewpoint - The article emphasizes the enduring entrepreneurial spirit of Zhang Jian, a patriotic industrialist from Nantong, and its influence on modern enterprises in the region, showcasing a legacy of innovation, education, and social responsibility that continues to inspire contemporary business practices [6][9][24]. Group 1: Historical Context and Legacy - Zhang Jian's contributions to Nantong include establishing China's first private cotton mill and the first museum run by Chinese nationals, which laid the foundation for a city that integrates industry, education, and culture [6]. - Over a century, Nantong has evolved into a "trillion-yuan city," with Zhang Jian's spirit becoming increasingly prominent through the efforts of modern entrepreneurs who continue to innovate and uphold his values [7][8]. Group 2: Entrepreneurial Spirit and Modern Practices - The essence of Zhang Jian's entrepreneurial spirit is characterized by patriotism, which drives contemporary business leaders to pursue industrial strength and innovation [9][10]. - Modern enterprises in Nantong, such as Tongfu Microelectronics and Zhongtian Technology, embody this spirit by focusing on technological advancements and contributing to national strategic goals, with Zhongtian Technology achieving over 100 billion yuan in revenue by 2024 [13][14][15]. Group 3: Social Responsibility and Community Impact - The commitment to social responsibility has evolved from Zhang Jian's individual efforts to a collective responsibility among modern entrepreneurs, emphasizing the importance of benefiting the community and promoting shared prosperity [24][25]. - Companies like Zhongtian Technology have significantly increased their charitable contributions, reflecting a long-term commitment to social welfare and community development [26][27]. Group 4: Globalization and Open Economy - The spirit of openness initiated by Zhang Jian continues to thrive, with Nantong's business community actively engaging in global markets, evidenced by the international expansion of companies like Tongfu Microelectronics [22][23]. - Nantong's strategic initiatives, such as the "Eight Dragons Crossing the River" plan, aim to enhance connectivity and foster economic growth, further solidifying its position in the global economy [22].

Core Viewpoint - The company, Changdian Technology (600584.SH), has reported a significant growth in its packaging and testing services for storage chips, driven by a recovery in market demand and strategic investments in technology and resources [1] Group 1: Business Performance - The company's packaging and testing services cover various storage chip products, including DRAM and Flash [1] - The storage-related packaging and testing business has seen continuous growth this year, with production capacity utilization rates gradually increasing to full capacity [1] - Revenue from the computing electronics business, which includes storage, has increased by nearly 70% year-on-year in the first three quarters, accounting for over 20% of total revenue [1]

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 12月10日消息，据报道，台积电目前面临 CoWoS 先进封装产能严重饱和的困境，已无法单独满足英伟 达、苹果等客户对 AI 芯片的爆发式需求。 为解决这一瓶颈， 台积电决定改变策略，将部分"溢出"订单外包给日月光投控和矽品精密等封测大 厂。 据悉，台积电现有的 CoWoS 生产线已处于"全额预订"状态，产能瓶颈严重制约了 AI 芯片的交付速 度。面对这一严峻挑战，台积电无法再独自消化所有订单，转而决定启动外包策略，将部分订单分流至 具备承接能力的合作伙伴。 台积电此次外包的主要对象锁定日月光投控和矽品精密等公司。这些厂商将负责承接台积电无法及时处 理的"溢出"订单。 这一策略调整背后还隐藏着深层的竞争考量：英特尔近期在先进封装领域动作频频，试图吸引苹果和高 通等客户。台积电通过外包扩充可用产能，能够有效避免客户因等待时间过长而流向竞争对手，从而巩 固其在高端封装市场的统治地位。 ***************END*************** 半导体公众号推荐 半导体论坛百万微信群 加群步骤： ...