先进晶圆级封装
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芯联集成注册资本增至83.8亿
Qi Cha Cha· 2026-01-04 08:31
Group 1 - The registered capital of ChipLink Integrated has increased from approximately 70.5 billion RMB to about 83.8 billion RMB [2] - The company underwent changes in several key personnel [2] - ChipLink Integrated was established in March 2018 and is involved in advanced wafer-level packaging, research and manufacturing of electronic components and optical components, as well as the development and manufacturing of photomasks [2] Group 2 - The company is jointly held by Shaoxing City Integrated Circuit Industry Fund Partnership (Limited Partnership) and SMIC Holdings [2]
芯联集成增资至83.8亿元,增幅约19%
Xin Lang Cai Jing· 2026-01-04 07:44
该公司成立于2018年3月,法定代表人为赵奇,经营范围包括先进晶圆级封装、电子元器件及光学元器 件研发及制造、光刻掩膜版开发制造等。股东信息显示,该公司由绍兴市越城区集成电路产业基金合伙 企业(有限合伙)、中芯国际控股有限公司、绍兴滨海新区芯兴股权投资基金合伙企业(有限合伙)等 共同持股。 天眼查工商信息显示,2025年12月31日,芯联集成(688469)发生工商变更,注册资本由约70.5亿人民 币增至约83.8亿人民币,增幅约19%,同时,多位主要人员发生变更。 ...