Core Insights - Black Semiconductor aims to integrate photonics directly into semiconductor production using graphene, creating a new type of chip that can communicate using both electronics and photonics [2][3] - The company is developing a new category of chips called EPIC (Electronic-Photonics Integrated Circuits), which simplifies the integration of these technologies without complex packaging processes [4] - Black Semiconductor is addressing challenges related to the quality, reproducibility, and scalability of graphene integration into chips [5] Group 1: Graphene and Its Applications - Graphene was initially thought to replace CMOS transistors due to its high mobility and conductivity, but its lack of a bandgap became an advantage for developing modulators and photodetectors [3] - The company has successfully demonstrated that graphene can absorb light effectively when layered on waveguides, leading to advancements in optical devices [3][4] - The integration of graphene allows for high-speed modulation and detection of light, which is crucial for future computing architectures [9] Group 2: Production and Development Challenges - Black Semiconductor faces significant challenges in integrating graphene into chips, particularly regarding the quality and reproducibility of the material [5] - The company is working on developing single-crystal graphene and scaling production from 200mm to 300mm wafers to enhance stability [5] - The transfer process of graphene to wafers is complex, and achieving the necessary reproducibility is critical for success [5] Group 3: Strategic Initiatives and Growth - The company has secured funding from the European Union's IPCEI initiative to build a 300mm integrated graphene photonics pilot production line, expected to be operational by mid-2026 [6] - Black Semiconductor has rapidly grown from 2 employees in 2022 to 130, with plans to reach 240 by next year, highlighting the challenges of talent acquisition and management [8] - The company aims to redefine computing by enhancing CMOS technology rather than replacing it, focusing on creating an active optical layer on the back of chips [11]

不过，专家团队指出，当前材料与器件结构的快速发展，已超出研究界系统测量与比较性能的能力范 围。由于新兴技术具有独特性，新现象与应用层出不穷，缺乏标准化方法将难以辨识真正的技术突破， 产业界也难以判断哪些技术具备实际应用价值。此外，现有研究多聚焦于单一性能指标的局部优化，而 缺乏推动技术落地所需的整体视角。 为此，由全球43所大学、研究机构和企业的53名专家联合组成的国际团队，共同提炼出光电探测器表征 的最佳实践方案，融合了多元视角、前沿研究与实际产业需求。 最终发布的报告为评估关键性能指标——如灵敏度、弱光性能、响应速度与稳定性等提供了明确指南， 并附有详细清单与实验示意图，以支持结果复现与有效比对。 来自全球学术界与工业界的专家团队，在新一期《自然·光子学》杂志上发表一项具有里程碑意义的共 识声明，倡议加速研发基于新兴光响应材料的新一代光电探测器，以推动医疗健康、智能家居、农业和 制造业等领域的创新应用。 该声明同时发布了《基于新兴半导体技术的光电探测器准确评估指南》，为表征、报告和评估新兴光传 感技术建立了统一框架。 光传感器又称光电探测器，是将光信号转换为电信号的装置。作为众多智能设备的核心部件，其全球 ...