Core Insights - The memory interconnect chip market is expected to grow from $768 million in 2020 to $1.168 billion by 2024, with a compound annual growth rate (CAGR) of 11.1% during this period, despite a decline in 2023 due to inventory adjustments in the server and computer industries [4][8][10] - China's memory interconnect chip market is projected to reach 1.66 billion yuan in 2024, accounting for approximately 20% of the global market, with a year-on-year growth exceeding 50% [12][10] - The industry is characterized by high technical barriers, leading to a concentrated market with the top three companies—Lanqi Technology, Renesas Electronics, and Rambus—holding 93.4% of the global market share, with Lanqi Technology leading at 36.8% [10][12] Market Overview - The global memory interconnect chip market is benefiting from continuous technological iterations and increasing penetration of AI servers, with growth expected in all years except 2023 [4][8] - The main products in the memory interconnect chip market include RCD/DB and module supporting chips, which are widely used in DDR4 and DDR5 memory modules, with RCD/DB expected to account for 59.5% of the market in 2024 [6][8] Industry Dynamics - The memory interconnect chip industry has significant technical barriers due to the complexity of product development, requiring deep technical expertise and long-term accumulation of intellectual property and design experience [10][12] - The industry follows JEDEC standards, and companies must engage in technical exchanges and collaborations with mainstream CPU, memory, server, and cloud computing manufacturers to establish a competitive edge [10] China's Market Position - China is becoming a significant player in the global AI and semiconductor sectors, with its memory interconnect chip market expected to continue expanding as downstream industries develop [12] - The market size for China's memory interconnect chips is projected to be 1.66 billion yuan in 2024, reflecting a strong growth trajectory [12] Product Development Trends - The transition from DDR4 to DDR5 memory technology is driving demand for memory interconnect chips, with DDR5 expected to dominate the market by 2024, accounting for over 50% of global server memory module shipments [17][19] - New high-bandwidth memory modules like MRDIMM are being developed to meet the increasing bandwidth demands of AI and high-performance computing applications, with significant improvements in data transfer rates expected [24][19] Application Areas - Memory interconnect chips are primarily used in server applications, with DDR5 technology providing higher speeds, lower power consumption, and increased capacity compared to DDR4 [16][19] - The PC market is also experiencing a shift towards AI PCs, with DDR5 memory modules expected to see increased demand as the market evolves [21][19]