Core Viewpoint - The company has developed an innovative integrated thinning and polishing machine that achieves international advanced levels in key technical indicators, catering to various substrates and critical processes in advanced packaging and chip stacking technologies [1] Group 1: Product Development - The company has created a CMP-cleaning integrated architecture thinning polishing machine that can cover silicon, glass, and other substrates for thinning bonded wafers [1] - The machine is recognized for its excellent technical performance and stable mass production capabilities, with over 20 units shipped to date [1] Group 2: Market Opportunities - The ongoing breakthroughs in domestic AI technology in algorithm architecture and computing power density are driving deep development opportunities in advanced packaging and chip stacking technologies [1] - The integrated thinning polishing machine works synergistically with other products like chemical mechanical polishing equipment and thinning film integrated machines, providing comprehensive solutions for cutting, grinding, and polishing in advanced packaging and chip stacking [1] Group 3: Future Growth Potential - The company has a strong order backlog, indicating robust market demand and potential for sustained high growth [1] - The application scenarios for the company's products are expected to continue expanding, injecting strong momentum for future growth [1]