前道半导体工艺设备(清洗设备

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盛美上海: 关于向特定对象发行A股股票摊薄即期回报与公司采取填补措施及相关主体承诺(二次修订稿)的公告
Zheng Quan Zhi Xing· 2025-05-21 12:09
Core Viewpoint - The company plans to issue A-shares to specific investors, aiming to raise up to RMB 4.482 billion for R&D, process testing platform construction, high-end semiconductor equipment iteration, and working capital supplementation [1][2]. Financial Impact - The issuance is expected to dilute immediate returns for existing shareholders, with potential impacts on key financial metrics such as earnings per share [3][4]. - The total share capital post-issuance could reach approximately 48.54 million shares, depending on various profit scenarios for 2025 [4][5]. Necessity and Reasonableness of the Issuance - The fundraising is aligned with the company's long-term development strategy and aims to enhance its competitive position in the semiconductor equipment industry [7][8]. - The projects funded by this issuance are closely related to the company's existing business, focusing on R&D and technological advancements [6][9]. Company’s Technological and Market Position - The company has established a strong presence in the semiconductor equipment sector, recognized for its advanced technologies and a comprehensive product line [11][10]. - The company has accumulated significant intellectual property, with 470 patents, enhancing its competitive edge [10]. Measures to Mitigate Dilution of Immediate Returns - The company plans to enhance its overall strength and expand its business scale post-issuance, improving risk resistance and market value [12]. - Internal management will be strengthened to reduce operational costs and improve efficiency [12]. - The company will accelerate the implementation of fundraising projects to achieve expected returns quickly [12][13]. Commitments from Management and Shareholders - The board and senior management have committed to fulfilling the measures to mitigate the dilution of immediate returns, ensuring the protection of shareholder interests [14].