Workflow
化镀及电镀材料
icon
Search documents
创智芯联拟港股IPO 中国证监会要求说明是否计划继续推进A股上市及具体安排等情况
Zhi Tong Cai Jing· 2025-08-08 11:15
Group 1 - The China Securities Regulatory Commission (CSRC) has requested Chuangzhi Xinian to provide supplementary explanations regarding its previous A-share listing guidance filing and the reasons for its withdrawal, as well as its plans for continuing the A-share listing process [1] - CSRC also requires Chuangzhi Xinian to clarify the qualifications of its road cargo transportation business and the compliance of its technology export activities over the past three years [1] - The company is involved in the production of metallization interconnection plating materials and key process technologies, focusing on wafer-level and chip-level packaging, as well as PCB manufacturing [2] Group 2 - Chuangzhi Xinian is recognized as the largest domestic supplier of wet process plating materials in the Chinese market, according to Frost & Sullivan, based on 2024 revenue [2] - The company has developed a complete product matrix for chemical plating and electroplating materials, covering applications in wafer-level packaging, chip-level packaging, and PCB manufacturing [2] - The CSRC has also requested clarification on the reasonableness of the share price for new shareholders in the past 12 months and whether there are any issues related to interests transfer [1][2]
新股消息 | 创智芯联拟港股IPO 中国证监会要求说明是否计划继续推进A股上市及具体安排等情况
Zhi Tong Cai Jing· 2025-08-08 11:12
此外,补充说明公司已实施的股权激励方案合规性,包括具体人员构成及任职情况,参与人员与发行人 其他股东、董事、监事、高级管理人员是否存在关联关系,以及价格公允性、协议约定情况、履行决策 程序情况、规范运行情况,并就其是否合法合规、是否存在利益输送出具明确结论性意见。补充说明公 司本次拟参与"全流通"的股东所持股份是否存在被质押、冻结或其他权利瑕疵的情形。 招股书显示,创智芯联是一家金属化互连镀层材料和关键工艺技术的方案提供商,致力于推动晶圆级和 芯片级封装,以及PCB制造领域镀层材料供应链发展。公司已开发出完整的化镀及电镀材料产品矩阵, 全面覆盖晶圆级封装、芯片级封装及PCB制造的应用场景。根据弗若斯特沙利文的资料,按2024年收入 计,公司是中国市场中最大的国内湿制程镀层材料提供商,同时是中国市场最大的一站式镀层解决方案 提供商。 智通财经APP获悉,8月8日,中国证监会公布境外发行上市备案补充材料要求公示(2025年8月1日— 2025年8月7日)。证监会要求创智芯联补充说明前期进行A股上市辅导备案的具体情况及撤回原因,是 否计划继续推进A股上市及具体安排、是否存在对本次发行上市产生重大影响的情形。据港交所 ...