Core Insights - The "X-Day" event focused on the semiconductor and integrated circuit industry, highlighting its importance as a national strategic sector and facilitating deep connections between technology innovation and capital [1][8]. Group 1: Event Overview - The event took place on September 4 at the Shenzhen University Town International Conference Center, gathering upstream and downstream companies, leading investment institutions, and industry experts [1]. - A strong lineup of guests included representatives from government, banks, and investment firms, as well as over a hundred investment institutions and industry experts [3]. Group 2: Featured Companies - Six high-quality companies presented at the event, showcasing innovations in key areas such as chip design, EDA tools, advanced packaging, third-generation semiconductors, and storage IP [4]. - Lingming Photon, founded in May 2018, specializes in single-photon avalanche diodes (SPAD) for 3D perception in various fields, including automotive and smart devices [6]. - Chuangfei Chip, based in Zhuhai, offers semiconductor storage IP and IC solutions, leveraging a team with experience from major firms like Intel and AMD [6]. - Zhongzeng Semiconductor focuses on manufacturing specialized equipment for compound semiconductor etching, providing integrated solutions [6]. - Weihe Technology, established in August 2022, provides 5G communication and edge AI chip solutions, with R&D centers in multiple locations [7]. - Ruiwo Microelectronics specializes in advanced packaging technology, having developed over 30 innovative materials and core patents [7]. - Rigoron focuses on EDA signoff tools for digital chip backend design, aiming to lead in domestic EDA solutions [7]. Group 3: Platform Achievements - Since its launch in March, the "X-Day" platform has hosted seven themed roadshows, receiving 185 project applications and facilitating over 2,000 connections with investment institutions, resulting in cumulative financing of over 360 million yuan [8]. - The platform has also successfully implemented its first technology insurance, providing 3 million yuan in product coverage [8]. Group 4: Future Plans - The event included a sub-forum for mergers and acquisitions, connecting eight listed companies in the semiconductor sector with ten financing and acquisition projects from across the country [10]. - The next "X-Day" event will focus on the "AI Model Camp" in October, continuing to build an open and efficient technology finance ecosystem [10][11].