Core Viewpoint - The company Jing Sheng Mechanical and Electrical (SZ300316) has announced significant changes to its investment projects in the semiconductor sector, including the termination of a semiconductor equipment project and a two-year delay for the 12-inch silicon wafer project. Group 1: Project Adjustments - The semiconductor equipment project, originally planned with an investment of 500 million yuan, has been terminated due to long procurement cycles for imported equipment, which did not meet the company's market response needs [6][5] - The remaining funds from the terminated project will continue to be managed in a dedicated account as per legal requirements [6][4] Group 2: Financial Overview - In 2022, the company raised 1.42 billion yuan through a private placement, allocating funds to three projects: the 12-inch silicon wafer project, the semiconductor equipment project, and working capital [2][4] - The semiconductor equipment project was expected to generate an annual sales revenue of approximately 623 million yuan and an average annual profit of about 165 million yuan upon completion [5] Group 3: 12-Inch Silicon Wafer Project - The 12-inch silicon wafer project has been postponed by two years, with a new expected completion date set for June 2027 [10][11] - The project aims to establish a comprehensive experimental line for various processes, including crystal growth, cutting, grinding, polishing, cleaning, and testing [8][10] - The company continues to affirm the necessity and feasibility of the 12-inch silicon wafer project despite the delay [11]