Group 1: Business Performance - The company's semiconductor business has been in full production since July 2025, with consistent shipment volumes and increasing new orders in Q4 2025 and Q1 2026 [2][3] - Revenue from the semiconductor and IoT safety monitoring businesses is approximately equal, each accounting for about 50% of total revenue as of mid-2025 [2][3] - The gross margin for the semiconductor business is expected to exceed 40% in 2024, with further improvements anticipated as high-end collaborative equipment sales increase and self-developed core components are integrated [3] Group 2: Product Development - The company is currently validating its laser slotting machines, laser cutting machines, and grinding machines at client sites, with efforts to expedite the development of integrated grinding and polishing machines [3] - The product structure of the domestic semiconductor equipment shows that standard models dominate shipments, but the sales proportion of high-end collaborative models is gradually increasing [3] Group 3: Market and Product Insights - Soft blades are primarily used for cutting various integrated circuit packaging types and hard materials, while hard blades are used for cutting silicon wafers and compound semiconductors [4] - The company’s subsidiary, ADT, has a stable and reliable soft blade product that has been well-received by global clients, including leading packaging and testing companies [4] Group 4: Convertible Bond Information - As of March 9, 2026, the company's stock price has been above 130% of the convertible bond's conversion price of 21.15 CNY per share for 12 trading days [5] - The company will carefully evaluate whether to exercise the redemption rights of the convertible bond if the conditions for conditional redemption are met in the future [5]

Group 1: Business Development - In Q1 2026, the company maintained a high production capacity for semiconductor slicing equipment, continuing the momentum from H2 2025 [2] - The IoT business remains stable, with efforts to enhance production efficiency and capacity to meet customer delivery demands [2] Group 2: Product Progress - The company is advancing its laser slicing machines and grinding machines, with ongoing client validation and development of a grinding and polishing integrated machine [2] - The domestic soft blade business is expected to see new growth opportunities in 2026, with several models already in mass production [3] Group 3: Client Base and Product Range - The company's air spindles are produced in the UK and China, serving high-precision processing clients in both domestic and international markets [4] - The 8230 model, a 12-inch dual-axis fully automatic wafer slicing machine, has the highest sales volume among domestic semiconductor slicing machines, with an increasing sales proportion of high-end models developed in collaboration with clients since 2025 [5] Group 4: Operational Stability - The geopolitical situation in the Middle East has limited impact on the operations of the Israeli subsidiary ADT, which remains stable and operational under government protection [6] - ADT's management has maintained communication with clients to ensure order delivery and minimize external disruptions, demonstrating strong risk management capabilities [6]