Group 1: Business Overview - The company benefits from the semiconductor industry's upward trend and the application of domestic cutting equipment in the packaging sector since July 2025, leading to rapid growth in its semiconductor business [2] - The IoT business has maintained stable development over the years, providing high-quality products and services to support clients in smart mining construction [2] Group 2: Project Development - The second phase of the airport factory project is expected to be fully completed and operational by Q1 2027, with a strategy of simultaneous construction and production to meet customer delivery needs [3] - The company will dynamically adjust the capacity enhancement pace based on market demand changes [3] Group 3: Product Development and Market Position - The laser dicing machine and mechanical dicing machine serve different cutting processes and applications, complementing each other rather than one replacing the other [3] - The company has developed laser slotting and laser stealth cutting machines, which are currently undergoing client validation [3] - The grinding machine is being validated with clients for 8-inch and 12-inch wafer back grinding, with positive feedback received [3] Group 4: Domestic Equipment Progress - The company has achieved batch sales of domestic mechanical dicing machines, which are recognized for their cutting quality and efficiency, comparable to international counterparts [4] - The revenue share from customized equipment is gradually increasing, with over twenty models of mechanical dicing equipment available, tailored to different customer application needs [4]