Core Viewpoint - The establishment of the South China headquarters R&D and production base by Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd. marks a significant step in enhancing its capabilities in the semiconductor and related industries, aiming to solidify its leading position in the global high-end semiconductor equipment market [2][3]. Group 1: Project Overview - The South China headquarters R&D and production base covers an area of approximately 130 acres with a total investment of 3 billion yuan [3]. - The first phase of the project, which has commenced, occupies about 50 acres and involves an investment of approximately 1 billion yuan, with completion expected by the end of 2026 and production planned for 2027 [3]. Group 2: Focus Areas - The base will initially focus on R&D and production in the large flat panel display equipment sector and will gradually expand into emerging fields such as smart glass and board-level packaging [3]. - The project aims to enhance product R&D and advanced manufacturing capabilities, further deepening the strategic layout in the semiconductor and broader semiconductor industry chain [3]. Group 3: Financial Performance - In the first half of 2025, Zhongwei Company achieved revenue of 4.961 billion yuan, representing a year-on-year growth of 43.88% [5]. - The net profit attributable to shareholders was 706 million yuan, an increase of 36.62% year-on-year, while the net profit after deducting non-recurring items was 539 million yuan, up 11.49% year-on-year [5].

Core Insights - The company, Zhongwei, has officially launched the construction of its South China headquarters R&D and production base in Zengcheng Economic and Technological Development Zone, Guangzhou [1] - The overall project covers approximately 130 acres, with the first phase occupying about 50 acres, expected to be completed by the end of 2026 and planned to commence production in 2027 [1] - The base will focus on R&D and production in the large flat panel display equipment sector and will gradually expand into emerging fields such as smart glass and board-level packaging [1]