Core Viewpoint - The company announced a change in the use of part of the funds raised from the issuance of convertible bonds, reallocating 155 million yuan to a new project focused on the research and manufacturing of optoelectronic semiconductor materials [2][3] Fund Allocation - The company plans to redirect 155 million yuan of the unused funds from the original project, which was aimed at the localization of key raw materials for optoelectronic semiconductor materials, to a new project for the "Optoelectronic Semiconductor Materials R&D Manufacturing Center" [2] - This change represents 17.03% of the total raised funds amounting to 910 million yuan [2] Project Details - The original project had a cumulative investment progress of 6.29% as of September 30, 2025, and was managed by Dinglong (Xiantao) New Materials Co., Ltd. [2] - The new project will be managed by Hubei Dinglong Holdings Co., Ltd., located west of the current factory in Wuhan, with a total investment of 288.18 million yuan and a construction period of three years [2] - The new project aims to establish a nine-story R&D manufacturing center, with production capabilities including 4,000 tons of prepolymer, 200 tons of microsphere foaming, 400,000 large silicon wafer polishing pads, 30 tons of alumina abrasives, and 50 tons of zinc oxide abrasives annually [2] Strategic Considerations - The change in project funding is aimed at optimizing resource allocation, prioritizing the development of advantageous businesses, and aligning with the company's current urgent needs and development strategy [3]