Group 1: Company Overview and Collaboration - Guangdong Zhongqi New Materials Co., Ltd. is transitioning from traditional construction materials to high-tech applications in the semiconductor industry, aiming for new growth points [4] - The collaboration with Xingkong Technology focuses on integrating high-end equipment manufacturing with Zhongqi's material production, enhancing capabilities in the semiconductor sector [4][5] Group 2: Product Development and Market Position - Xingkong Technology's product line includes specialized lithography machines, chip bonding machines, and optical inspection equipment, targeting advanced packaging and AI chip manufacturing [5][6] - The company aims to achieve micron-level precision in advanced packaging, with expectations to reach sub-micron levels (0.7 to 0.8 microns) by the second half of the year [9] Group 3: Future Strategies and R&D Focus - Future development will emphasize advanced packaging technologies, including 2.5D and 3D packaging, to meet the growing demands of AI applications [5][6] - The company plans to maintain a strong R&D focus, with approximately 60% of its workforce dedicated to research and engineering [11] Group 4: Competitive Landscape and Supply Chain - Xingkong Technology differentiates itself from competitors by focusing on AI chip manufacturing, with a unique technical approach and application focus [12] - The company maintains a strong domestic supply chain but does not completely exclude international suppliers for critical components, ensuring a secure and controllable production environment [12]