Core Viewpoint - Hefei Jinghe Integrated Circuit Co., Ltd. (Jinghe Integrated) has submitted its prospectus for an IPO on the Hong Kong Stock Exchange, aiming to establish an "A+H" listing structure after its successful listing on the Sci-Tech Innovation Board in May 2023 [1][3]. Group 1: Company Overview - Jinghe Integrated, founded in 2015, is a leading global 12-inch pure wafer foundry, focusing on advanced process research and application, providing wafer foundry services across various process nodes from 150nm to 40nm, and steadily advancing its 28nm platform [3]. - The company has a comprehensive and differentiated wafer foundry technology in fields such as DDIC, CIS, PMIC, Logic IC, and MCU, with applications in consumer electronics, smartphones, smart home appliances, security, industrial control, and automotive electronics [3]. Group 2: Financial Performance - For the reporting period from 2022 to the first half of 2025, Jinghe Integrated's revenue figures are as follows: 10.026 billion, 7.183 billion, 9.12 billion, and 5.13 billion yuan, with a year-on-year revenue growth of 18.5% in the first half of this year [4]. - The net profit for the same periods was 3.156 billion, 119 million, 482 million, and 232 million yuan, indicating some fluctuations in profitability [4]. - Research and development expenditures during the reporting period were 857 million, 1.058 billion, 1.284 billion, and 695 million yuan, with a cash and cash equivalents balance of 3.1 billion yuan as of June 30, 2025, indicating a strong liquidity position [4]. Group 3: Future Plans - The funds raised from the IPO will be used to enhance the company's technological competitiveness by developing and optimizing a new generation 22nm technology platform, as well as establishing an intelligent system that integrates research and production processes [4][5]. - Plans also include setting up a research and sales center in Hong Kong to facilitate R&D and sales activities, along with general corporate purposes [5].