Core Viewpoint - The "Beijing Atomic-Level Manufacturing Innovation Development Action Plan (2026-2028)" emphasizes the development of high-precision scientific instruments and testing technologies, focusing on semiconductor and new materials sectors, with 20 key tasks outlined for technological breakthroughs [1][2]. Group 1: Instrument and Testing Equipment Breakthroughs - The plan includes a specific focus on "Atomic-Level Performance Measurement Equipment," aiming to develop high-end scientific instruments for atomic-scale measurement across three main areas: ultra-high precision measurement, micro-analysis detection, and extreme trace detection [1][2]. - Ultra-high precision measurement targets the development of laser interferometry equipment to achieve "sub-angstrom" precision, essential for advanced chip manufacturing [1]. - Micro-analysis detection involves creating integrated measurement equipment for failure analysis and defect localization in integrated circuits, addressing the need for material microstructure analysis [2]. - Extreme trace detection aims to develop equipment for detecting ultra-low concentration pollutants, targeting "ppb-level" gas sensing, crucial for environmental monitoring and semiconductor process cleanliness [2]. Group 2: Software Development for Atomic-Level Manufacturing - The action plan outlines the development of various software to support atomic-level manufacturing, including dynamic simulation software, process design software, phase change control software, and surface detection software [4][5]. - These software solutions aim to enhance precision modeling, process optimization, and quality monitoring in atomic-level manufacturing [4]. Group 3: Equipment for Atomic-Level Processing - The plan supports breakthroughs in equipment for atomic-level processing, including single crystal silicon wafer removal, atomic precision etching, and ultra-high vacuum maintenance equipment [6][7]. - Specific goals include achieving atomic-level precision in silicon wafer etching and developing equipment for the preparation of two-dimensional metal materials [6][7]. Group 4: Performance Measurement Equipment - The action plan emphasizes the development of laser interferometry measurement equipment and packaging detection equipment to meet the needs of advanced packaging integrated circuit chip failure analysis [10][11]. - The focus is on achieving high-resolution magnetic field detection and temperature field measurement capabilities [10]. Group 5: Application Breakthroughs - The plan aims to create typical applications in semiconductor manufacturing and new material creation, focusing on polishing, deposition, thinning, and detection processes [12]. - It emphasizes the integration of atomic-level manufacturing technologies and equipment to meet the demands of advanced semiconductor processes and special performance materials [12]. Group 6: Support Measures - The action plan includes measures to cultivate technology-based SMEs, high-tech enterprises, and innovative companies in the atomic-level manufacturing sector [13]. - It aims to secure national funding support and strengthen the talent pool in the industry, promoting the establishment of standardized committees and pilot platforms for atomic-level manufacturing [13].