点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 | | 武汉(二期) | Fab2 | 300 | Z3Z/云 | 6 | 8.0(2026年) | 企业级SSD、数据中 | | --- | --- | --- | --- | --- | --- | --- | --- | | | | | | TLC/QLCNAN | | | | | | | | | D | | | 心存储芯片 | | | | | | 19nm (LPDDR | | | | | | | Fab1 | 300 | 4/5) | | 8.0(满产) | 智能手机内存、AI服 | | | | | | 25nm(DDR4) | | | 务器DDR4/DDR5 | | 长鑫存储 | | | | 17nm(DDR5 | | | | | | | Fab2 | 300 | 试产) | 3.0(爬坡 | 8.0(2027年) | 高端服务器DDR5、 | | | | | | 19nm (LPDDR | 中) | | 车规级LPDDR5 | | | | | | 5) | | | | | | | | | 5 ...

Investment Strategy - The first phase of the National Integrated Circuit Industry Investment Fund (大基金一期) was established in 2014 with a registered capital of 98.7 billion, and actual funds received were approximately 120 billion [3] - The second phase (大基金二期) was established in 2019 with a registered capital of 204.2 billion, and actual funds received were around 220 billion [3] - Significant investments from both phases were directed towards wafer manufacturing, including companies like SMIC, Hua Hong Semiconductor, and Changjiang Storage [3] - Investments also extended to packaging segments, with companies such as Tongfu Microelectronics and Jiangsu Changjiang Electronics Technology [5] - The strategy focused on addressing the largest gaps in the semiconductor industry, particularly in manufacturing, while also investing in chip design, exemplified by companies like Huawei's HiSilicon [6][7] Management - The management of both phases is handled by Huaxin Investment Management Co., Ltd. (华芯), established in 2014 specifically for managing the fund [9] - The largest shareholder of Huaxin is the National Development Bank, which is also a significant contributor to the fund [9] - In the first phase, the Ministry of Finance was the largest contributor (36%), followed by the National Development Bank (22%), while in the second phase, the Ministry of Finance contributed 11.02% and the National Development Bank 10.78% [10] - The management structure raised questions about the dual role of the National Development Bank as both a manager and a major limited partner, reflecting a high level of trust from the state [10] - The first phase involved collaboration with other semiconductor investment institutions to mitigate risks, while the second phase saw a more mature investment capability with no additional management entities [10][11]

人民财讯9月6日电，9月5日，华润微电子在重庆园区召开12吋功率半导体晶圆生产线产品上量专题会， 会上宣布项目提前一年半达成月产出30000片目标。 ...

前7个月旅行服务出口同比增超六成 9月5日，商务部服贸司公布数据显示，2025年1—7月，我国服务贸易稳步增长，服务进出口总额45781.6亿元，同比增长8.2%。其中，出口 19983亿元，增长15.3%；进口25798.6亿元，增长3.3%。服务贸易逆差5815.6亿元，比上年同期减少1836.2亿元。旅行服务出口增长最快，1— 7月旅行服务进出口达12594.6亿元，增长10.4%。其中，出口增长62.9%，进口增长3.9%。 此外，1—7月，知识密集型服务进出口17756亿元，增长6.8%。其中，其他商业服务、电信计算机和信息服务进出口7509.7亿元、6268亿元， 增速分别为3.4%、12.6%。当前，服务贸易在外贸"盘子"中的占比仍然较低，2024年占外贸总额比重仅为14.6%。（界面新闻） ｜点评｜ 从国际经验来看，经济体发展到一定水平后，商品消费往往增长乏力，服务消费则存在较大提升空间。当前阶段，全球贸易重心逐渐 向服务贸易转移，近年服务贸易出口增速明显高于货物出口。这一趋势下，我国服务业对外开放程度不断加深，限制措施也逐步减少。在旅行 服务领域，免签政策优化等效果较快显现，前7个月旅行服务 ...

人民财讯9月5日电，捷捷微电（300623）9月5日晚间公告，公司董事张祖蕾、黎重林、颜呈祥、监事沈 志鹏、高级管理人员徐洋，计划15个交易日后的3个月内，以集中竞价方式减持公司股份。 其中，张祖蕾拟减持不超过529.32万股，占公司总股本的0.64%；黎重林、颜呈祥各拟减持不超过20.59 万股，各占公司总股本的0.0247%；沈志鹏拟减持不超过5925股，占公司总股本的0.0007%；徐洋拟减 持不超过2.14万股，占公司总股本的0.0026%。 ...

Core Viewpoint - Pragmatic Semiconductor is pioneering flexible semiconductor technology, aiming to disrupt the traditional rigid silicon-based chip market with its innovative manufacturing processes and products [1][4][7]. Group 1: Company Overview - Pragmatic Semiconductor was founded in 2010 in Cambridge, UK, and has established the first 300mm wafer production line in the UK [1]. - The company emphasizes sustainable manufacturing, projecting to become the largest wafer producer in the UK by the end of the year, capable of meeting global demand with billions of chips [4]. Group 2: Technology and Manufacturing Process - The company produces flexible wafers using traditional chip manufacturing equipment, with a manufacturing process node of approximately 180nm, which helps keep costs low [6]. - Pragmatic Semiconductor's unique design allows for rapid production, completing the process from raw materials to final product in just a few days, compared to months for traditional silicon-based semiconductors [6][7]. - The use of glass substrates and a polymer called polyimide differentiates their production process from traditional silicon chip manufacturing [6]. Group 3: Product Features and Applications - The company utilizes thin-film transistor (TFT) technology and application-specific integrated circuit (ASIC) design processes to create high-density flexible integrated circuits (FlexIC) that can be applied to various substrates like paper, plastic, and metal [7]. - FlexIC products are customizable and suitable for applications in smart packaging, clothing, toys, and supply chain management, offering significant market potential [7]. Group 4: Product Development and Future Plans - At the IOTE 2025 event, Pragmatic showcased its third-generation technology platform capable of producing flexible ICs with a bending radius of up to 5mm and various electrical specifications [8][11]. - The company plans to expand its product line, including NFC Connect, NFC Protect, and NFC Sense, targeting cost-sensitive markets such as healthcare and apparel [13][14]. - By 2026, Pragmatic aims to launch a fourth-generation product with reduced power consumption and size, and by 2027, a fifth-generation platform with even lower power usage and additional EEPROM technology [14].

对于三星来说，过去几年备受煎熬。这不但体现在其存储业务上，其寄以厚望的晶圆代工业务也举 步维艰。但随着良率的提升以及公司和特斯拉达成的新协议，这家韩国芯片巨头似乎又充满了信 心，并加大了对下一代光刻机的抢购。 据报道，三星此前已确认 Exynos 2600 将是该公司首款 2nm GAA 芯片组，而最近又有报道称这 款旗舰级 SoC 已开始量产。这家韩国晶圆代工厂的最大愿望就是最大限度地减少损失、提高良 率，以便能够大规模生产自有芯片，同时向业界证明其在芯片领域的领先地位能够与台积电相媲 美。 为了帮助公司实现目标，一份报道称，三星正在从 ASML 引进更多高数值孔径 EUV 光刻机，并 将其添加到其本地生产中。虽然这些设备价格不菲，但它应该能为公司带来必要的优势。据 Fnnews 报道，三星斥巨资购置这些设备的目的是为了在 2 纳米 GAA 制程中占据优势。 毋庸置疑，在ASML看来，High NA EUV会是未来的头等大事。在此前的二季度财报说明会 上，荷兰设备巨头也确认了一台高数值孔径EUV的收入。他们指出，虽然该项收入确认拉低 了毛利率，但总体上依然带来53.7%毛利率的强劲表现。 根据ASML在其第 ...

证券代码：688126 证券简称：沪硅产业 公告编号：2025-062 上海硅产业集团股份有限公司 关于发行股份及支付现金购买资产并募集配套资金 暨关联交易报告书（草案）（上会稿）修订说明的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 〔2025〕32 号） （以下简称"《审核中心意见落实 函》")。根据《审核中心意见落实函》及上海证券交易所审核意见的要求，公 司于 2025 年 9 月 6 日披露了《上海硅产业集团股份有限公司发行股份及支付现 金购买资产并募集配套资金暨关联交易报告书（草案） （上会稿）》 （以下简称"草 上海硅产业集团股份有限公司（以下简称"公司"）拟通过发行股份及支付 现金方式购买上海新昇晶投半导体科技有限公司、上海新昇晶科半导体科技有限 公司、上海新昇晶睿半导体科技有限公司的少数股权，并募集配套资金（以下简 称"本次交易"）。 公司于 2025 年 9 月 4 日收到上海证券交易所出具的《关于上海硅产业集团 股份有限公司发行股份及支付现金购买资产并募集配套资金的审核中心意见落 实函》 （上证 ...

证券日报网讯扬杰科技（300373）9月5日在互动平台回答投资者提问时表示，公司当前产能利用率保持 在高位水平，基本处于满产状态。 ...

2025 年 9 月 5 日 星期五 每日大市点评 9 月 4 日，港股大盘延续跌势，恒生指数下跌 1.1%，收报 25,058 点，险守 25,000 点；恒生科技指数下跌 1.9%，收报 5,578 点。大市成交额 3,022 亿港元，港股通仅净流入 7.1 亿港元，显示跌市下内资观望情绪浓厚。盘面上，权重科技股 普遍承压，阿里巴巴（9988 HK）跌 3.2%，小米（1810 HK）跌超 2%。大金融板块走势分化，内险股中国太保（2601 HK） 跌超 5%，内银股尾盘虽有拉升但仍显疲弱，农业银行（1288 HK）上涨 2.1%最为强势。半导体板块跌幅明显，中芯国际 （981 HK）跌 6.7%。黄金股、生物医药股均大幅回调。另一方面，餐饮股、乳制品股等部分消费股逆势上涨。市场整体 情绪低迷，呈现结构分化特征。 9 月以来全球股市震荡加剧，港股自 8 月下旬起短线及中线市宽转弱，已提前预示调整风险。当前恒指预测 PE 达 11.3 倍，处于 2018-2019 年高位区间，叠加风险溢价处于历史低位，短期估值进一步再扩张的难度较大。港股盈利端呈现结构 性分化，除信息科技、材料及金融板块盈利预期上修外，多数 ...