Core Viewpoint - The company is transitioning from panel manufacturing to semiconductor IC packaging, with a focus on fan-out panel-level packaging products, which have begun stable shipments. The chairman anticipates a recovery in the panel industry by 2026, with a positive start to the year [1][2]. Group 1: Transition to Semiconductor Industry - The company has successfully entered the semiconductor industry by launching fan-out panel-level packaging services, utilizing chip-first technology for satellite ground reception device packaging. The current focus is on consolidating existing customers rather than expanding [1]. - The chairman mentioned that the fan-out panel-level packaging technology involves advanced through-silicon via (TSV) technology, which is energy-intensive, and there is no rush to ship these products next year. The company aims to obtain customer certification for TSV and redistribution layer (RDL) technologies in the coming year [1]. Group 2: Market Outlook for the Panel Industry - The chairman noted a slight price increase for some panel products in December, indicating a potential price increase atmosphere for January. He believes that the fourth quarter of 2025 will be the bottom of the panel industry, with a recovery expected in 2026, particularly for TV panels [2]. - Currently, the company is not signing long-term contracts exceeding one year with customers, only one-year agreements with flexible pricing adjustments. There is some urgency for orders due to rising memory prices, but future developments remain uncertain [3]. Group 3: Strategic Developments and Workforce - The company has approximately 40,000 employees, excluding recent mergers with Pioneer through its subsidiary CarUX. It is diversifying into the automotive and semiconductor packaging industries while consolidating panel production capacity towards a light-asset model [5]. - The chairman emphasized the importance of smaller generation factories, such as 3.5-generation plants, for fan-out panel-level packaging, as larger generation lines may incur higher costs if production fails. Smaller factories transitioning to semiconductor packaging services can sometimes be more advantageous [5].