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至纯科技公布国际专利申请:“一种分开取放晶圆的片叉单元结构、晶圆传输机构和方法”
Sou Hu Cai Jing· 2025-10-13 21:31
Core Insights - ZhiChun Technology (603690) has filed an international patent application for a new wafer handling structure and method, with the application number PCT/CN2025/086853, published internationally on October 9, 2025 [1][4] Group 1: Patent Information - The patent is titled "A structure of a fork unit for separate loading and unloading of wafers, wafer transfer mechanism, and method" [1] - This marks the fifth international patent application by ZhiChun Technology this year, representing a 61.54% decrease compared to the same period last year [4] Group 2: R&D Investment - In the first half of 2025, ZhiChun Technology invested 118 million yuan in research and development, which is a 17.59% increase year-on-year [4]