Group 1 - The stock price of Chipbond Technology is reported at 128.90 yuan, down by 6.10 yuan from the previous trading day [1] - The opening price for the day was 135.33 yuan, with a high of 137.33 yuan and a low of 126.40 yuan, resulting in a trading volume of 97,436 lots and a transaction amount of 1.265 billion yuan [1] - Chipbond Technology specializes in the research, production, and sales of semiconductor equipment, with its products primarily used in integrated circuits, advanced packaging, and new display fields [1] Group 2 - The company announced that its wafer-level and panel-level direct-write lithography equipment series has received purchase orders from several leading domestic packaging and testing companies [1] - The products will be applied in large-size chip packaging fields such as SoW, CIS, and CoWoS-L [1] - The first batch of equipment is expected to be put into customer production lines by the end of the year [1]

转自：证券时报 人民财讯8月19日电，芯碁微装今日宣布，其面向中道领域的晶圆级及板级直写光刻设备系列已获得重 大市场突破。公司已与多家国内头部封测企业签订采购订单，产品主要应用于SoW、CIS、类CoWoS-L 等大尺寸芯片封装方向。此次获得多家国内头部封测企业的认可，标志着芯碁微装的产品性能与可靠性 已达到业界领先水平。基于此，并结合目前的市场反馈和业务规划，公司预计从今年年底到明年，订单 量将呈现持续批量增长趋势，其规模有望再上一个新台阶。首批设备预计于今年底开始，陆续投入客户 的量产线。这将有力支持国内封测产业链应对日益增长的高性能大尺寸AI芯片封装需求，加速高端封 装技术的国产化进程。 ...