板卡模组以及电子设备
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比亚迪公布国际专利申请:“快拆组件、板卡模组以及电子设备”
Sou Hu Cai Jing· 2026-03-06 21:55
Core Viewpoint - BYD has filed an international patent application for a "quick-release component, board module, and electronic device," with the application number PCT/CN2025/076895, set to be published internationally on March 5, 2026 [1] Group 1: Patent Application - The patent application reflects BYD's ongoing innovation efforts in the electronic device sector [1] - The company has filed a total of 455 international patent applications this year, representing a significant increase of 461.73% compared to the same period last year [1] Group 2: R&D Investment - In the first half of 2025, BYD invested 29.596 billion yuan in research and development, which is a year-on-year increase of 50.84% [1]