Core Insights - Huawei's Vice Chairman Xu Zhijun presented a clear development roadmap for its Ascend AI chips, targeting a million-card cluster by 2028, indicating a significant leap in computing power [1][2] - The introduction of the "Lingqu" all-optical interconnection protocol is expected to revolutionize the field of computing interconnectivity, enhancing data transfer speeds and overall efficiency [2] Group 1: Huawei's AI Chip Development - Huawei plans to rapidly iterate its Ascend AI chips, with the Ascend 950 series launching in 2026, followed by the Ascend 960 in 2027, and the Ascend 970 in 2028, aiming for a tenfold increase in overall computing power [1][2] - The Ascend 960 chip will achieve a comprehensive doubling of key metrics such as computing power and memory bandwidth, while the Ascend 970 will further enhance interconnect bandwidth and memory bandwidth [1] Group 2: Super Node Technology - The Atlas 950 super node, built on the new "Lingqu" protocol, is anticipated to maintain a leading position in global computing power for the coming years [2] - The establishment of large-scale computing clusters, potentially reaching 500,000 to 1,000,000 cards, will significantly reduce data transfer delays and enhance computational efficiency [2] Group 3: Implications for AI Development - With robust computing infrastructure, China's AI models are expected to experience explosive growth, positioning them among the global leaders in AI technology innovation and application [2]