ASMPT（00522）公布2025年业绩，销售收入为港币 145.2 亿元（18.6 亿美元），按年增长9.8%。综合 除税后盈利为港币 9.02 亿元，按年增加 163.6%。每股基本盈利港币 2.17 元，末期股息每股港币 0.34 元及特别现金股息每股港币 0.79 元。 在人工智能（AI）的驱动下，集团先进封装（AP）业务取得销售收入 5.32 亿美元，按年增长 30.2%， 其中热压焊接（TCB）解决方案的贡献最为显著。 集团的主流业务销售收入按年增长 3.3%，主要受人工智能数据中心对数据传输及能源管理的需求，以 及中国电动汽车（EV）行业和外判半导体装嵌及测试（OSAT）企业的高产能利用率所驱动。然而，中 国以外的汽车及工业市场应用仍然疲软。 受 TCB 驱动，先进封装的销售收入按年增长 30.2%，先进封装占集团总销售收入由 26%按年增长至 2025年的 30%。 此外 预期2026年第一季度销售收入在4.7 亿美元至 5.3 亿美元之间，以其中位数计按季下跌 1.8%，按年 则增长 29.5%。以中位数计算，集团的2026年第一季度销售收入预测（仅持续经营业务）已高于目前市 场预期。集团 ...

Core Insights - ASMPT reported a sales revenue of HKD 36.6 billion for the third quarter, representing a year-on-year growth of 9.5% [1] - The total new orders amounted to HKD 36.21 billion, reflecting a year-on-year increase of 14.2% [1] Group 1: Business Performance - The advanced packaging (AP) segment, particularly the thermal compression bonding (TCB) solutions, received repeat orders from clients in advanced memory and logic applications [1] - The mainstream business benefited from the ongoing adoption of artificial intelligence (AI), with increased demand for AI infrastructure in data centers, data transmission, and energy management [1] Group 2: Market Dynamics - In the Chinese market, the demand for semiconductor solutions (wire bonders, die bonders) and surface mount technology solutions, primarily for electric vehicles (EVs), continued to grow [1] - The high utilization rates of outsourced semiconductor assembly and testing facilities, along with China's leading position in the electric vehicle market, contributed to the increased demand in the mainstream business [1]