Core Insights - ASMPT reported a sales revenue of HKD 36.6 billion for the third quarter, representing a year-on-year growth of 9.5% [1] - The total new orders amounted to HKD 36.21 billion, reflecting a year-on-year increase of 14.2% [1] Group 1: Business Performance - The advanced packaging (AP) segment, particularly the thermal compression bonding (TCB) solutions, received repeat orders from clients in advanced memory and logic applications [1] - The mainstream business benefited from the ongoing adoption of artificial intelligence (AI), with increased demand for AI infrastructure in data centers, data transmission, and energy management [1] Group 2: Market Dynamics - In the Chinese market, the demand for semiconductor solutions (wire bonders, die bonders) and surface mount technology solutions, primarily for electric vehicles (EVs), continued to grow [1] - The high utilization rates of outsourced semiconductor assembly and testing facilities, along with China's leading position in the electric vehicle market, contributed to the increased demand in the mainstream business [1]

Core Viewpoint - ASMPT reported a mixed performance for the first half of 2025, with revenue growth driven by AI-related applications, while facing challenges in profitability due to foreign exchange impacts and tax incentives [1][3]. Financial Performance - Sales revenue reached HKD 6.53 billion, a year-on-year increase of 0.7% but a decrease of 3.3% compared to the previous half [1]. - Net profit after tax was HKD 217 million, down 30.9% year-on-year but up 672.7% half-on-half [1]. - Adjusted profit was HKD 218 million, reflecting a year-on-year decrease of 30.7% but a half-on-half increase of 95.7% [1]. Market Contribution - The computer terminal market contributed the most to total sales, accounting for 30% of revenue, driven by AI applications in memory and logic sectors [1]. - The automotive terminal market was the second-largest source, making up 15% of total sales, benefiting from demand for electric vehicles in China [1]. - The communications terminal market accounted for 13% of total sales, supported by demand for photonics and high-end smartphones [1]. Order and Backlog - Total new orders amounted to HKD 7.11 billion, with a year-on-year growth of 12.4% and a half-on-half increase of 10.5% [2]. - The backlog of unfulfilled orders reached HKD 6.85 billion, with an order-to-ship ratio of 1.09 [2]. Regional Performance - Sales in China grew year-on-year, increasing its share of total sales to 36.7%, while Korea and Taiwan also saw increases [2]. - Sales in Europe and the Americas declined due to weak market conditions in surface mount technology solutions, with Europe’s share dropping to 11.4% and the Americas to 12.3% [2]. Future Outlook - The company expects third-quarter sales revenue to be between USD 445 million and USD 505 million, indicating a year-on-year growth of 10.8% and a quarter-on-quarter increase of 8.9% [3]. - The company remains confident in sustainable growth in advanced packaging sales, driven by the AI wave and its technological leadership [3]. - The total potential market for TCB is projected to reach USD 1 billion by 2027, with a focus on maintaining leadership in memory and logic applications [3].