受 TCB 驱动，先进封装的销售收入按年增长 30.2%，先进封装占集团总销售收入由 26%按年增长至 2025年的 30%。 此外 预期2026年第一季度销售收入在4.7 亿美元至 5.3 亿美元之间，以其中位数计按季下跌 1.8%，按年 则增长 29.5%。以中位数计算，集团的2026年第一季度销售收入预测(仅持续经营业务)已高于目前市场 预期。集团预计半导体解决方案分部将继续取得按季增长，主要由 TCB 和高端固晶机所推动，但被表 面贴装技术解决方案分部的季节性因素所抵销。销售收入按年增长主要由表面贴装技术解决方案分部的 强劲势头及半导体解决方案分部的稳定增长所推动。 集团预计于2026年第一季度的毛利率将有所改善，主要由于 TCB 和高端固晶机的销量增加推动半导体 解决方案分部的毛利率重回 40%中位数水平。然而，由于汽车及工业终端市场持续疲弱，表面贴装技 术解决方案分部毛利率将维持于相若水平。 ASMPT(00522)公布2025年业绩，销售收入为港币 145.2 亿元(18.6 亿美元)，按年增长 9.8%。综合除税 后盈利为港币 9.02 亿元，按年增加 163.6%。每股基本盈利港币 2.17 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行董事： 黃梓达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） [新聞稿] ASMPT LIMITED （於開曼群島註冊成立之有限公司） （股份代號：0522） 二零二五年全年業績新聞稿 有關 ASMPT Limited 及其附屬公司截至二零二五年十二月三十一日止全年業績 的新聞稿附載於本公告。 承董事會命 董事 黃梓达 香港，二零二六年三月四日 ASMPT 公布二零二五年全年業績 人工智能驅動的結構性增長鞏固集團業績 集團業績概覽 關鍵亮點 集團財務概要 | (港幣百萬元) | 二零二五年 第四季度 | ...

Core Insights - ASMPT reported a sales revenue of HKD 36.6 billion for the third quarter, representing a year-on-year growth of 9.5% [1] - The total new orders amounted to HKD 36.21 billion, reflecting a year-on-year increase of 14.2% [1] Group 1: Business Performance - The advanced packaging (AP) segment, particularly the thermal compression bonding (TCB) solutions, received repeat orders from clients in advanced memory and logic applications [1] - The mainstream business benefited from the ongoing adoption of artificial intelligence (AI), with increased demand for AI infrastructure in data centers, data transmission, and energy management [1] Group 2: Market Dynamics - In the Chinese market, the demand for semiconductor solutions (wire bonders, die bonders) and surface mount technology solutions, primarily for electric vehicles (EVs), continued to grow [1] - The high utilization rates of outsourced semiconductor assembly and testing facilities, along with China's leading position in the electric vehicle market, contributed to the increased demand in the mainstream business [1]

Core Viewpoint - ASMPT reported a mixed performance for the first half of 2025, with revenue growth driven by AI-related applications, while facing challenges in profitability due to foreign exchange impacts and tax incentives [1][3]. Financial Performance - Sales revenue reached HKD 6.53 billion, a year-on-year increase of 0.7% but a decrease of 3.3% compared to the previous half [1]. - Net profit after tax was HKD 217 million, down 30.9% year-on-year but up 672.7% half-on-half [1]. - Adjusted profit was HKD 218 million, reflecting a year-on-year decrease of 30.7% but a half-on-half increase of 95.7% [1]. Market Contribution - The computer terminal market contributed the most to total sales, accounting for 30% of revenue, driven by AI applications in memory and logic sectors [1]. - The automotive terminal market was the second-largest source, making up 15% of total sales, benefiting from demand for electric vehicles in China [1]. - The communications terminal market accounted for 13% of total sales, supported by demand for photonics and high-end smartphones [1]. Order and Backlog - Total new orders amounted to HKD 7.11 billion, with a year-on-year growth of 12.4% and a half-on-half increase of 10.5% [2]. - The backlog of unfulfilled orders reached HKD 6.85 billion, with an order-to-ship ratio of 1.09 [2]. Regional Performance - Sales in China grew year-on-year, increasing its share of total sales to 36.7%, while Korea and Taiwan also saw increases [2]. - Sales in Europe and the Americas declined due to weak market conditions in surface mount technology solutions, with Europe’s share dropping to 11.4% and the Americas to 12.3% [2]. Future Outlook - The company expects third-quarter sales revenue to be between USD 445 million and USD 505 million, indicating a year-on-year growth of 10.8% and a quarter-on-quarter increase of 8.9% [3]. - The company remains confident in sustainable growth in advanced packaging sales, driven by the AI wave and its technological leadership [3]. - The total potential market for TCB is projected to reach USD 1 billion by 2027, with a focus on maintaining leadership in memory and logic applications [3].