Core Viewpoint - The company, Shenling Environment, is actively researching various cooling plate technologies, including water-cooled plates, microchannel plates, and heat pipe phase change plates, anticipating increased commercialization opportunities due to rising chip thermal density [1] Group 1 - The company has multiple types of cooling plate technologies under research [1] - There is an expectation for more gradual commercialization opportunities in the future [1] - The driving factor for these opportunities is the increasing thermal density of chips [1]

Group 1 - The company, Shenling Environment (301018.SZ), is engaged in research on various cooling plate technologies, including water-cooled plates, microchannel cold plates, and heat pipe phase change cold plates [1] - The company anticipates that as chip thermal density increases, there will be more opportunities for gradual commercialization in the future [1]