Group 1 - New Henghui's market capitalization exceeds 10 billion, with a closing increase of 229%, focusing on semiconductor packaging materials [2][4] - The core project of fundraising is the industrialization of high-density QFN/DFN packaging materials, aiming to break through technical barriers in high-end packaging materials [5] - The company has a monthly production capacity of 35 million eSIM chips, which will further enhance the domestic substitution rate of high-end packaging materials after the new project is put into production [5] Group 2 - New Henghui's main business is centered around chip packaging materials, forming a three-pronged driving pattern of smart card business, etched lead frames, and IoT eSIM packaging [6] - The smart card business is expected to contribute over 70% of revenue in 2024, with a global market share of 32% for flexible lead frames, ranking second [6] - The etched lead frame business, launched in 2019, has strong synergy with smart card packaging processes and is applied in power semiconductors and sensors [7] Group 3 - New Henghui's revenue has shown steady growth over the past three years, with projected revenues of 684 million, 767 million, and 842 million for 2022-2024, and net profits of 110 million, 152 million, and 186 million [8] - The company’s earnings are expected to be driven by the etched lead frame and eSIM packaging businesses, which are anticipated to grow significantly in the automotive electronics and IoT sectors [8] - The current issuance price-to-earnings ratio of 17.76 is significantly lower than the industry average of 37.99, providing valuation support for the stock price [8] Group 4 - The controlling shareholders of New Henghui are Yu Renrong and Ren Zhijun, holding a combined 51.25% of shares, with Yu Renrong being the largest shareholder [9] - Ren Zhijun has experience in the entire semiconductor industry chain, having previously served as vice chairman of Unisoc [9] - The shareholder list includes notable semiconductor investment institutions and government-backed capital, indicating recognition of the company's technological strength [11]