联发科天玑9500芯片
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vivo X300系列发布:搭载联发科天玑9500芯片,4399元起
Feng Huang Wang· 2025-10-13 13:18
Core Points - Vivo officially launched the X300 series flagship smartphones on October 13, 2023, in Shanghai, with a starting price of 4399 yuan for the standard version and 5299 yuan for the pro version, set to go on sale on October 17 [1] - The X300 series features the MediaTek Dimensity 9500 chip and a jointly developed "Blue Crystal × Dimensity 9500" imaging solution, marking a significant technological advancement [1][2] - The devices are equipped with a 6040mAh battery utilizing fourth-generation silicon-carbon anode materials, enhancing battery capacity while maintaining a slim profile [1][2] Design and User Experience - The X300 series has a thickness of 7.95mm and weighs 190g, with a black border width of 1.05mm on the screen [1] - The design includes a floating water droplet cold-sculpted glass for the camera area, and a velvet glass back that resists fingerprints, available in four colors: Free Blue, Lucky Color, Comfortable Purple, and Pure Black [1] - The new OriginOS 6 system features a natural and comfortable motion design, with an average application launch response time of 72 milliseconds [2] Imaging and Video Capabilities - The standard version includes a 200MP Zeiss main camera, while the Pro version features a 200MP APO super telephoto lens, enhancing photography capabilities significantly [2][3] - The Pro version supports advanced video features, including 4K 120fps Dolby Vision recording and editing capabilities, showcasing a collaboration with Jianying for video editing [3] - The devices also include professional-grade stabilization features, with CIPA 5.5 stabilization and dual-view recording modes [2][3] Performance and Connectivity - The X300 series achieved a score exceeding 410,000 on AnTuTu, indicating high performance [3] - All models are equipped with USB 3.2 Gen1, ultrasonic fingerprint recognition, wireless fast charging, and IP68/IP69 dust and water resistance [3]
库克尴尬了,苹果A芯片从曾经的领先安卓一年,到现在全面落后
Sou Hu Cai Jing· 2025-09-25 03:51
Group 1 - Qualcomm has launched its flagship mobile SoC, Snapdragon 8 Elite Gen5, utilizing TSMC's N3P process technology, joining Apple and MediaTek in releasing their top chips for the year [1] - In terms of performance, Apple's A19 Pro is now the weakest among the three, with MediaTek's Dimensity 9500 slightly outperforming it in single-core and multi-core tests, while Qualcomm's Snapdragon 8 Elite Gen5 surpasses both [3] - Apple's A-series chips, which previously led the market, are now lagging behind, indicating a shift in competitive dynamics within the mobile chip industry [5] Group 2 - The decline in Apple's chip performance is attributed to its shift in focus towards developing multiple chip lines, including M-series chips, which has diluted resources and attention from the A-series [8] - Qualcomm has transitioned to using its own Oryon CPU cores, while MediaTek has adopted ARM's latest C1 cores, allowing them to catch up to Apple's performance [8] - Despite the performance metrics, there is a perception that real-world usage of Qualcomm and MediaTek chips may not match their benchmark scores, with Apple's iOS still being a significant advantage [10]