Core Viewpoint - Wenzhou Hongfeng (300283) is actively developing its semiconductor materials business, focusing on etching lead frame materials essential for integrated circuit chip packaging [1] Company Summary - The company's subsidiary, Zhejiang Hongfeng Semiconductor Materials Co., Ltd., specializes in the research, manufacturing, and sales of etching lead frame materials [1] - These materials are critical for connecting internal and external circuits in chip manufacturing [1] - The company is currently advancing its product certification and market development efforts, although specific customer information is confidential [1] Industry Summary - The primary raw materials for semiconductor lead frames are currently sourced externally [1]

Group 1 - The company, Wenzhou Hongfeng (300283.SZ), primarily engages in the research, production, and sales of electrical contact materials, metal-based functional composite materials, hard alloy materials, high-performance ultra-thin lithium battery copper foil, and etched lead frame materials [2] - The company confirmed that its current products and business do not involve PEEK materials, despite PEEK's advantages such as high temperature resistance, high strength, corrosion resistance, and biocompatibility, which make it one of the best-performing engineering plastics [2]

Core Viewpoint - Wenzhou Hongfeng (300283.SZ) primarily engages in the research, production, and sales of electrical contact materials, metal-based functional composite materials, hard alloy materials, high-performance ultra-thin lithium battery copper foil, and etched lead frame materials, and does not involve PEEK materials [1] Company Overview - The company specializes in various advanced materials, including electrical contact materials and high-performance ultra-thin lithium battery copper foil [1] - Current product lines and business operations do not include PEEK materials, indicating a focused product strategy [1]