Core Viewpoint - ASMPT has secured a new order from a major client for two ultra-fine pitch thermal compression bonding (TCB) machines utilizing proprietary plasma active oxide removal (AOR) technology, reinforcing its leadership in the advanced packaging market [1] Group 1: Company Developments - ASMPT's stock price increased by over 8% during trading, with a current price of 107 HKD and a trading volume of 343 million HKD [1] - The new order for TCB equipment is aimed at chip-to-wafer (C2W) applications, highlighting the company's technological advancements [1] Group 2: Industry Insights - SMIC's executives indicated that the company's capital expenditure for 2025 is projected to be 8.1 billion USD, exceeding earlier expectations due to strong customer demand and extended equipment delivery times [1] - For 2026, SMIC expects its sales revenue growth to surpass the average of comparable peers, with capital expenditure remaining roughly stable compared to 2025, assuming no significant changes in the external environment [1]