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Pre-IPO轮10亿融资!上海这家半导体材料公司开启IPO辅导备案!
Xin Lang Cai Jing· 2025-12-16 14:03
Company Overview - Shanghai Tongchuang Purun New Materials Co., Ltd. was established in July 2021 with a registered capital of 287.35 million yuan [2][4] - The company specializes in the research and production of ultra-pure metal materials for chip manufacturing, achieving world-leading levels with materials such as 6N aluminum, 6N tantalum, 7N copper, and 5N manganese [2][4] - As the sole domestic supplier of high-purity materials for Jiangfeng Electronics, the company's jointly developed ultra-pure aluminum, copper, and manganese sputtering targets have entered first-class international chip factories, holding over 40% of the global market share, ranking first in the world [2][4] Financing Situation - The company completed over 2 billion yuan in financing in 2025, including 1 billion yuan in Series B financing in August and 1 billion yuan in Pre-IPO financing in October [6][7] - The Pre-IPO financing round on October 15, 2025, raised 1 billion yuan, with investors including Shanggu Capital [7] - The Series B financing round on August 21, 2025, also raised 1 billion yuan, with notable investors such as SAIC Group and China National Building Material New Materials Fund [7]