Core Viewpoint - The company is developing high-performance thermal film materials based on POD (polyoxadiazole), which have extensive applications in the thermal management of electronic devices. The project has now entered the pilot testing phase [1]. Group 1 - The company is focused on the development of thermal film materials [1] - The materials are based on POD, indicating a specialized approach to thermal management [1] - The project is currently in the pilot testing stage, suggesting progress towards commercialization [1]

Core Insights - The company clarified that the previously mentioned mobile heat dissipation film and aramid thermal conductive film are not the same product [2] - The company is currently developing a high-performance thermal conductive film material based on POD (polyoxadiazole), which has broad applications in the thermal management of electronic devices [2] - The project has entered the pilot test stage, indicating progress in the development process [2]