Core Viewpoint - The demand for semiconductor equipment has significantly increased since July, leading to a reduction in delivery cycles and full production capacity for the company's domestic semiconductor slicing machines, prompting plans for a second phase of expansion [2][3]. Semiconductor Equipment Demand - The company has observed a strong demand for semiconductor equipment, with a notable increase in shipment volumes starting from the third quarter of this year, and this growth trend is expected to continue until 2026 [3]. - The company's semiconductor packaging and testing equipment includes precision processing equipment, high-performance air spindles, and consumables, establishing a competitive advantage in the semiconductor slicing field [3]. Market and Product Focus - The company's semiconductor packaging and testing equipment primarily serves OSAT and IDM manufacturers in Europe, Southeast Asia, and China, providing solutions in the slicing and grinding domain [4]. - The air spindle, a core component of the company's products, is also applicable in various precision manufacturing fields beyond semiconductors, with successful deliveries across multiple sectors [4]. Mergers and Acquisitions - The company has made three overseas acquisitions post-IPO, integrating technology and channels in the semiconductor equipment market, particularly in the wafer slicing sector [5]. - The acquired subsidiary ADT is among the top three global semiconductor slicing machine manufacturers, while the UK subsidiary LP is recognized for its pioneering work in air spindles [5]. Technological Advancements - The company is focused on high-precision slicing machines, which are critical for chip quality and production costs, utilizing advanced technologies such as high-precision air spindles and automated systems [6]. - The company aims to leverage its R&D capabilities across the UK, Israel, and China to enhance customer service and meet market demands effectively [6]. AI Integration - The company is advancing its "Artificial Intelligence+" initiative, integrating AI into manufacturing processes to enhance operational efficiency and drive strategic upgrades from equipment providers to intelligent solution service providers [7]. - AI is seen as a core driver for the company's growth, particularly in the context of the semiconductor industry's recovery, influencing the decision to initiate a second phase of production expansion [7]. - The integration of AI and large model technologies is also being applied internally to improve R&D and operational processes, thereby reducing costs and enhancing innovation focus [8].

Core Insights - The company has observed a significant increase in demand for semiconductor equipment since July, with shorter delivery cycles and full production capacity for its domestic semiconductor slicing machines, prompting plans for a second phase of expansion [1] - The semiconductor equipment sector is seen as a key indicator of the semiconductor industry's health, with expectations of overall recovery starting in 2024 and a substantial increase in equipment shipments beginning in Q3 of this year, likely continuing until 2026 [1] Semiconductor Equipment Demand - The company's semiconductor packaging and testing equipment includes precision processing equipment, high-performance air spindles, and consumables, establishing a competitive advantage in the semiconductor slicing field [2] - The company serves OSAT and IDM manufacturers in markets including Europe, Southeast Asia, and China, providing solutions in slicing and grinding, with its air spindle technology applicable in various precision manufacturing sectors [2] Mergers and Acquisitions - Following its IPO, the company made three overseas acquisitions to integrate technology and channels in the semiconductor equipment market, particularly in the wafer slicing sector, and has achieved initial mass production of high-end slicing machines through independent R&D [2][3] R&D and Technology Development - The company faced challenges in replicating technologies from acquired firms and opted to learn from the ground up, aligning its R&D with international standards [3] - The acquired subsidiary ADT is a leading player in semiconductor slicing machines, while the UK subsidiary LP is recognized for its innovations in air spindle technology [3] Product and Market Strategy - The company aims to leverage its R&D capabilities across the UK, Israel, and China, utilizing the advantages of its subsidiaries to enhance customer response and service capabilities [4] - The company is committed to integrating AI into its operations, viewing it as a core driver for transitioning from an equipment provider to an intelligent solution service provider [5] AI Integration and Innovation - The company is optimistic about the semiconductor industry's recovery, which is a key reason for its rapid expansion plans, and is focused on deep integration of AI with its core technologies and market demands [5] - AI is being utilized to enhance the company's IoT systems, transforming them from passive monitoring to proactive warning and decision support systems, significantly improving service value for mining clients [6]