Core Viewpoint - The article highlights the participation of Accuracy in SEMICON China 2025, showcasing its advancements in semiconductor packaging equipment, particularly in achieving nanometer-level precision in its products [2][10]. Company Overview - Accuracy, established in 2010 and headquartered in Suzhou Industrial Park, specializes in the research, manufacturing, and sales of high-precision advanced packaging equipment for semiconductors [10]. - The company has focused on the die bonding equipment sector for 15 years, providing high-precision, high-capacity, reliable, and intelligent equipment for next-generation semiconductor materials and advanced packaging processes [10]. Event Details - SEMICON China 2025 will take place from March 26 to March 28, 2025, at the Shanghai New International Expo Center, with Accuracy exhibiting at booth N4-4000 [4]. - The event will feature interactive sessions and expert one-on-one technical exchanges, emphasizing the company's commitment to innovation and customer engagement [7][10]. Product Offerings - Accuracy offers a range of high-precision equipment, including multi-chip placement machines, wafer-level hybrid bonding equipment, and flip-chip placement equipment, aimed at advanced packaging, IC packaging, power semiconductors, optical communication, and sensors [10]. - The company boasts nanometer-level ultra-high precision technology and military-grade quality standards, enabling rapid response through modular design in its research and development [10].