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沐曦/摩尔线程/壁仞科技IPO狂欢背后的冷思考:2026年一场"隐形风暴"已至
3 6 Ke· 2025-12-19 09:30
Core Insights - The Chinese semiconductor industry is experiencing a significant transformation, marked by the successful IPOs of domestic GPU companies such as MuXi and Moer Thread, reflecting a collective investor sentiment towards "computing power autonomy" [1][2] - The value focus in the semiconductor sector is shifting from centralized computing power to "ubiquitous intelligence," indicating a profound change in the IoT semiconductor landscape [1] Group 1: Current Trends - The listings of MuXi and Moer Thread occur during a unique time when AI applications are rapidly emerging, making computing power a fundamental resource [2] - The expansion of computing power is moving from data centers to edge and terminal devices, driven by the maturation of AI technology and decreasing costs [3][4] Group 2: Predictions for IoT Semiconductor Industry - Prediction 1: The integration of edge AI will accelerate, leading to widespread application of IoT devices equipped with edge AI capabilities by 2026 [7] - Prediction 2: Modular design (Chiplet) and open architecture (RISC-V) will see significant growth, allowing for more flexible and cost-effective chip designs [10][11] - Prediction 3: Carbon footprint tracking will become a critical design constraint, alongside performance, power consumption, and cost [12][13] - Prediction 4: Localized production of IoT chips will increase, driven by government incentives and the need for supply chain security [16][17] - Prediction 5: AI will evolve from a supportive tool to a co-pilot in the design process, automating routine tasks and allowing engineers to focus on higher-level decisions [18][19] - Prediction 6: Security design will transition from an optional feature to a regulatory requirement, necessitating built-in hardware protections [20][21] Group 3: Strategic Recommendations - For chip design companies: Shift focus from parameter competition to scenario differentiation and evaluate the availability of lightweight NPU reserves [24] - For equipment manufacturers (OEMs): Avoid reliance on cloud-based intelligence and seek SoC suppliers that support edge inference capabilities [27] - For industry investors: Look for companies providing AI EDA plugins, compliance automation tools, and Chiplet interconnect IP, as they are likely to be the winners in the upcoming market [29] Group 4: Future Landscape - The semiconductor industry's value will transition from "peak computing power" to "intelligent density per unit energy consumption" and "lifecycle security compliance" [31] - The global semiconductor supply chain will evolve from a unipolar dominance to a multipolar coexistence, emphasizing the importance of regional chip ecosystems [32]
芯原股份:集成了芯原NPU IP的人工智能(AI)类芯片已在全球范围内出货近2亿颗 正积极推进智慧出行领域Chiplet解决方案平台研发
Ge Long Hui A P P· 2025-12-18 11:08
格隆汇12月18日|芯原股份(688521.SH)发布投资者关系活动记录表,终止收购芯来智融97%股权事项 不会对公司正常业务开展和生产经营活动造成不利影响。未来公司将继续强化在RISC-V领域的布局; 作为芯来智融的股东,公司将与其保持并深化合作关系。目前,集成了芯原NPU IP的人工智能(AI) 类芯片已在全球范围内出货近2亿颗。目前,公司已为某知名新能源汽车厂商提供基于5nm车规工艺制 程的自动驾驶芯片定制服务,正在积极推进智慧出行领域Chiplet解决方案平台研发。基于上述技术布 局,芯原正在与一系列汽车领域的关键客户进行深入合作。 ...
研报掘金丨爱建证券:首予拓荆科技“买入”评级,认为公司具备较高中长期配置性价比
Ge Long Hui A P P· 2025-12-18 07:55
格隆汇12月18日|爱建证券研报指出,拓荆科技是国内领先的前道薄膜沉积设备厂商,核心产品覆盖 PECVD、ALD、Flowable CVD、HDPCVD 等多类工艺,已在先进逻辑与存储产线实现规模化交付;同 时,公司前瞻布局混合键合及配套量检测设备,切入异构集成与三维集成核心环节,业务由单一沉积设 备向"沉积+ 键合"双引擎平台化演进。在晶圆厂扩产与国产替代推动下,中国市场预计仍将保持全球最 大半导体设备市场。HBM、Chiplet 与三维堆叠加速落地,芯片间互连密度和界面质量要求显著提升, 沉积与键合工艺在系统性能中的重要性持续上升,使相关设备需求具备独立于制程节点的成长逻辑。从 PEG角度看,公司2025E-2027E PEG为1.3/0.8/0.9,综合考虑其在薄膜沉积和混合键合工艺环节的技术壁 垒及中长期盈利弹性,认为公司具备较高的中长期配置性价比。首次覆盖,给予"买入"评级。 ...
人工智能时代,EDA巨变
半导体芯闻· 2025-12-02 10:18
如果您希望可以时常见面,欢迎标星收藏哦~ 但如上所述,AI 的到来,让更强算力的芯片成为迫切需求。在这种环境,Chiplet模式就成为自 然选择。 "通过将不同功能模块以'芯粒'形式拆分,并借助先进封装完成系统级集成,一方面可以显著提升 良率与灵活性,另一方面也为多工艺异构集成开辟现实路径。"代文亮介绍说。在他看来,这种 拆分的模式能够给芯片性能的提升带来巨大利好,先进封装的发展比我们想象的快很多,随着先 进封装持续演进,其对系统性能的影响已经不亚于制程节点。 在日前的ICCAD 2025峰会演讲中,芯和半导体科技(上海)股份有限公司(以下简称"芯和") 创始人兼总裁代文亮博士直言:"AI正在引领的是第四代工业革命,AI在云、管、端各个领域都 有渗透,且应用场景越来越多。但对于AI而言,底层的AI算力才是决定其走势的关键。" 众所周知,随着模型越来越大,AI对芯片算力的要求大幅攀升,叠加当前摩尔定律放缓带来的影 响,传统的单芯片SoC的设计模式已经不再满足终端的需求。于是,为了实现芯片设计的设计范 式跃迁,芯片的整条供应链也正在发生新的转变。 芯和正从EDA方面给行业提供新的参考。 芯片设计变了 "半导体产业 ...
从 Chiplet 到超节点:奇异摩尔正在塑造中国 AI 算力的“互联底座”
半导体行业观察· 2025-11-26 00:39
在 AI 大模型的推动下,算力竞争正从"单卡比拼"走向"集群博弈"。越往前走,行业越清楚: 决定上限的,已经不再是一颗 GPU 的峰值算力,而是隐藏在背后,由芯粒(Chiplet)、封 装与互联共同构成的系统底座。 我们看到,算力架构正从单芯片走向多芯粒、超节点,如何在如此复杂的系统中,依然保持 高带宽互联、灵活扩展与高效调度,正成为新一代算力生态的关键命题。 在刚刚结束的 ICCAD 2025 上,半导体行业观察走进奇异摩尔展台,围绕"用芯粒互联重构 AI 算力生态"这一主题,与奇异摩尔联合创始人兼产品及解决方案副总裁祝俊东进行了深入 交流。 Q 您认为,互联是否是实现自主算力的关键环节? 随着超节点架构兴起,GPU互联不仅是技术升级,更是系统模式的重塑。您如何看待 超节点架构带来的业务与系统挑战?奇异摩尔是如何应对和布局的? 祝俊东: 超节点是计算中心领域这两年比较火的话题。过去大家对于超节点到底有没有用还存 在争议,但是我觉得从去年开始,这个争议已经基本平息了,大家都一致认为超节点是一个非常重 要的方向,并且现在无论是国内或国外,都已经开始大规模商业化。为什么会有超节点呢?这个技 术本身是有非常高的互联 ...
芯和代文亮博士:AI时代,要把EDA 这条“脖子”练粗
半导体行业观察· 2025-11-25 01:20
Core Viewpoint - The EDA industry is undergoing a methodological reconstruction due to the exponential increase in AI model scale and computing power requirements, transitioning from a "design tool" to the underlying operating system of AI computing systems [1][3]. Group 1: Challenges in EDA - The main challenge for domestic EDA in ensuring the autonomy of AI computing systems lies in the need to consider the entire system rather than just the chip, especially as Moore's Law becomes less applicable [3]. - The evolution of computing architecture from single chips to multi-chiplets and supernodes presents new challenges in maintaining flexibility, scalability, and high-bandwidth interconnects [4]. Group 2: Chiplet Architecture - The Chiplet design requires new verification and collaboration processes, with a two-phase approach: the first phase focuses on integrating computing and storage through a 2.5D structure, while the second phase involves hybrid bonding for 3D stacking [4]. - The integration of various components such as sensors, storage, and RF devices into a compact design necessitates multi-physical field collaborative analysis, which increases the complexity of simulation across different scales [4][6]. Group 3: System-Level Simulation - System-level simulation differs significantly from traditional EDA, as it must account for multi-physical field interactions and the potential for issues arising from high current and impedance fluctuations [5]. - Chiplet architecture offers advantages in system-level considerations, allowing for a more comprehensive approach to design and integration [5]. Group 4: AI Integration in EDA - The strategy of "EDA for AI" focuses on providing comprehensive solutions from chip design to system integration, addressing the challenges posed by AI's increasing computational demands [10]. - The "AI + EDA" strategy aims to integrate AI models into the design and simulation processes, significantly enhancing efficiency and enabling a shift from rule-driven to data-driven design approaches [12]. Group 5: Future Outlook - The future of EDA in the AI era is characterized by cross-scale, cross-physical, and cross-system engineering, with expectations for more domestic design tools to become practical and for system-level issues to be resolved during the simulation phase [14]. - The company is positioned as a key player in this transformation, leveraging advancements in Chiplet technology, supernodes, and AI factories to enhance the stability and power of AI computing infrastructure [14].
每周股票复盘:和顺石油(603353)拟收购奎芯科技控股权
Sou Hu Cai Jing· 2025-11-22 18:36
Core Viewpoint - The company, Heshun Petroleum, is experiencing significant stock price movement and is planning a strategic acquisition to enhance its business model and market position in the semiconductor industry [1][2][4][8]. Trading Information Summary - Heshun Petroleum's stock closed at 30.59 yuan on November 21, 2025, up 9.13% from the previous week, with a market cap of 5.259 billion yuan [1]. - The stock reached a peak of 35.88 yuan on November 20, 2025, marking a near one-year high, and recorded two instances of limit-up trading without any limit-down occurrences [1][2]. Shareholder Changes - The actual controllers, Yan Ximing and Zhao Zunming, along with their concerted actors, plan to transfer a total of 6% of the company's shares (10,314,360 shares) to Chen Wanyi at a price of 22.932 yuan per share, totaling approximately 236.53 million yuan [3][8]. - Following this transfer, the controlling shareholders' stake will decrease from 66.5817% to 60.5817%, without changing the company's control [3]. Institutional Research Highlights - The company intends to acquire at least 34% of Shanghai Kuixin Integrated Circuit Design Co., Ltd. and will control 51% of the voting rights through a voting rights entrustment [4][8]. - The valuation for 100% of Kuixin's equity is capped at 1.588 billion yuan, with the expected transaction amount not exceeding 540 million yuan [4][8]. Company Announcement Summary - The board of directors approved the acquisition of Kuixin Technology, which is expected to enhance Heshun Petroleum's capabilities in the semiconductor sector, particularly in high-speed interface IP products [8]. - The company plans to hold a shareholder meeting on December 5, 2025, to discuss changes in business scope and amendments to the articles of association [8][9]. Industry Context - Kuixin Technology operates in the semiconductor IP sector, focusing on high-speed interface IP products, with a strong customer base in SSD and AI chip markets [4][5][7]. - The company aims to become a leader in the domestic interconnect IP and Chiplet market, which is projected to be significantly larger than the IP market alone [7].
无锡超级IPO,来了
投中网· 2025-11-21 08:22
Core Viewpoint - Wuxi's IPO landscape is rapidly expanding, highlighted by the emergence of Shenghe Jingwei, a notable unicorn in the semiconductor industry, which is preparing for its A-share listing [5][11]. Group 1: Shenghe Jingwei's Development - Shenghe Jingwei was established in 2014 with investments from leading semiconductor companies, aiming to create a complete domestic 12-inch integrated circuit manufacturing chain [8]. - The company has achieved significant milestones, including becoming the first in mainland China to mass-produce 14nm silicon wafer bump processing [10]. - By 2024, Shenghe Jingwei is projected to have the largest 12-inch bump manufacturing capacity in mainland China, providing advanced packaging services for various high-performance chips [10]. Group 2: Financial Performance - Shenghe Jingwei's revenue from 2022 to mid-2025 is expected to grow from approximately 1.633 billion to 3.178 billion yuan, with net profits transitioning from a loss of 329 million yuan to a profit of 435 million yuan [10]. - The company has attracted significant investment, with a valuation reaching 20 billion yuan after a C+ round financing in 2023 [14]. Group 3: Wuxi's IPO Landscape - Wuxi has seen a surge in IPOs, with four companies listed in A-shares since 2025, and a total of 167 listed companies, including 126 A-share companies [6][19]. - The local government has implemented various supportive measures to facilitate the growth of listed companies, contributing to Wuxi's economic development [19][20]. Group 4: Economic Impact - Wuxi's GDP is projected to reach approximately 1.63 trillion yuan in 2024, with a growth rate of 5.8% [20]. - The city is recognized for its strong manufacturing base, with Jiangyin County leading in the number of listed companies among county-level cities in China [20].
陈立武讲中文!英特尔中国区董事长亮相,晒AI“全家福”
Sou Hu Cai Jing· 2025-11-20 11:02
Core Insights - Intel is celebrating its 40th anniversary in China with a special exhibition at the Technology Innovation and Industry Ecosystem Conference held in Chongqing, where CEO Pat Gelsinger shared the company's strategic vision and blessings for the Chinese market [2][4]. Group 1: Company Strategy and Market Position - Intel aims to create a more powerful, focused, and execution-oriented organization to help customers tackle critical challenges and gain market advantages [4][6]. - The company has partnered with over 15,000 industry partners in China and has significantly contributed to the PC and cloud computing markets, with approximately 1 billion PCs shipped since 2001 [4]. - Intel's future CPU designs will utilize Chiplet architecture, emphasizing a commitment to innovation and collaboration with local partners [4][6]. Group 2: Product Innovations and Technology Advancements - Intel plans to launch new products, including the Panther Lake at CES next year, which will feature the Intel 18A technology, promising over 15% performance improvement per watt and a 25% reduction in power consumption compared to Intel 3 [8][14]. - The Panther Lake platform will combine high efficiency and performance, achieving over 50% improvement in multi-core and graphics performance, while reducing power consumption by 40% [16][21]. - Intel's XeSS technology will enhance gaming experiences by upscaling 1080p to 4K quality, with over 300 games already supporting this technology [21]. Group 3: AI and Data Center Solutions - The AI-driven data center market is expected to grow significantly, with a projected 3.5 times increase in the next five years, necessitating robust data center solutions [28]. - Intel's Xeon 6 processors are positioned as the preferred CPU for data centers, offering significant upgrades in memory and I/O bandwidth, with performance improvements of over 20% for various applications [30][33]. - The Gaudi 2E accelerator is tailored for generative AI inference and is compatible with Chinese open-source models, facilitating the deployment of large models in various sectors [40][42]. Group 4: Ecosystem Collaboration and Industry Impact - Intel's collaboration with industry partners has led to the introduction of over 1,600 components, achieving a 100% local component satisfaction rate [25]. - The company hosted over 3,000 industry partners at the conference, showcasing more than 10,000 innovative solutions and sharing practical application experiences [47].
聚焦产业链精准对接与协同创新……集成电路产业链合作对接交流会在无锡举行
Yang Zi Wan Bao Wang· 2025-11-20 09:42
Core Insights - The event held on November 19 in Wuxi focused on high-quality development paths for the integrated circuit industry, emphasizing collaboration and resource sharing among key players in the sector [1][4] - Jiangsu's integrated circuit industry has maintained its position as the largest in China, with Wuxi, Nanjing, Suzhou, and Nantong forming differentiated industrial clusters [2] Industry Performance - In the first three quarters of this year, China's integrated circuit production reached 381.9 billion units, an increase of 8.6%, while exports totaled 265.3 billion units, growing by 20.3% [2] - The integrated circuit sector is the largest in terms of import and export for Jiangsu province, highlighting its significance in the national economy [2] Investment and Development - Six key integrated circuit projects were signed at the event, with a total investment of 2.6 billion yuan, covering semiconductor equipment, materials, and components [3] - Wuxi has established a complete industrial chain encompassing design, manufacturing, testing, and materials, with over 600 companies contributing to a revenue of 114.5 billion yuan in core sectors [2][3] Future Focus - Wuxi aims to address critical weak links in the industry, such as photolithography and electronic measurement equipment, while advancing cutting-edge technologies like Chiplet and HBM [2] - The event facilitated a platform for effective communication and collaboration among integrated circuit enterprises, promoting deep integration of industry, academia, and research [4]