本报（chinatimes.net.cn）记者石飞月 北京报道 在AI浪潮席卷全球半导体产业的宏大叙事下，芯原股份在10月8日交出了一份亮眼的2025年第三季度成 绩单：单季营收创历史新高，同比猛增近八成，亏损大幅收窄，前三季度新签订单更是超越去年全年， 其中AI算力相关订单占据可观比重。然而，这份充斥着"大幅增长"的公告背后，却隐藏着一个令人费解 的现实：自2023年第四季度启动的、已持续八个季度的"订单高位"周期，为何迟迟未能将这家公司从亏 损的泥潭中彻底拖出？ AI算力驱动订单大增 芯原股份预计2025年第三季度实现营业收入12.84亿元，单季度收入创公司历史新高，环比大幅增长 119.74%，同比大幅增长78.77%。 具体到业务层面，一站式芯片定制业务实现了大幅增长。芯原股份的一站式芯片定制服务具体分为两个 主要环节：芯片设计业务和芯片量产业务。该公司预计2025年第三季度芯片设计业务实现收入4.29亿 元，环比增长291.76%，同比增长80.67%；预计量产业务实现收入6.09亿元，环比增长133.02%，同比增 长158.12%。 订单量的增加是推动收入增长的关键因素。芯原股份预计，该公司20 ...

2025 年 10 月1 5-17日 ， 第二届湾区半导体产业生态博览会（湾芯展2025） 将在 深圳会展中心（福田） 盛 大举办。 作为备受瞩目的半导体行业盛会，本届湾芯展 60,000m 2 展览面积，将携手国内外 600 余家 半 导体优质企 业，预计为 60,000+ 专业观众带来贯穿半导体产业链的前沿技术成果和最新解决方案。 展会时间 2025年10月15日 9:00-17:00（周三） 2025年10月16日 9:00-17:00（周四） 2025年10月17日 9:00-16:00（周五） 展会地点 深圳会展中心（福田） 1/2/9号馆 交通指引 福利放送： 免费公交/地铁乘车券 展会期间，观众可凭参观证到【咨询处】领取纸质乘车券，数量有限，先到先得。 行李寄存点 如需行李寄存服务，可前往1号馆1Q32【行李寄存处】 观众进馆流程 ①扫码注册 扫描下方二维码，填写基本信息完成预登记，凭"我的胸卡"，前往"自助打印处"打印证件。 ②自助/人工换证 自助换证：观众签到处（201、205、215） 人工换证：205 ③入场核验 一人一证，凭证件入场 注： 本展会为专业性展会，谢绝18周岁以下人士入场。 ...

每经记者｜孔泽思 每经编辑｜魏文艺 数百家国内外龙头企业将云集深圳，展现全球半导体产业最新成果。10月15日~17日，"2025湾区半导体产业生态博览会"（以下简称"湾芯展"）将在深圳会 展中心举行。 《每日经济新闻》记者（以下简称每经记者）从10月10日上午深圳市政府新闻办举行的新闻发布会上获悉，今年的湾芯展将全面对标"更高规格、更广辐 射、更深融合、更优服务"的目标，展览面积超过6万平方米，参展企业超过600家。 深圳市发展和改革委员会主任郭子平在发布会上透露，2024年深圳半导体产业规模达2564亿元，同比增长26.8%。今年上半年产业规模达1424亿元，继续保 持16.9%的快速增长，展现出强劲发展势头。 在国际化方面，湾芯展吸引了来自全球20多个国家超600家龙头骨干企业及知名院校机构参展，并特邀欧洲、东南亚、日韩等地区官方机构和龙头企业代 表，将举办中国制造出海国际供需对接会等多场国际专业论坛。 在品牌化方面，湾芯展着力打造具有全球影响力的"中国半导体自主品牌第一展"。据悉，北方华创、新凯来、拓荆科技、上海微电子、华虹宏力、华润微电 子、华天科技等国内头部企业将悉数参展。 "今年3月28日，新凯来 ...

（文章来源：证券日报） 证券日报网讯易天股份10月9日在互动平台回答投资者提问时表示，公司控股子公司微组半导体专注于 全自动微米级高精度微组装设备、Mini LED返修设备的研发，是一家集设计、生产和销售、服务为一 体的半导体微组装设备专业制造商。在半导体先进封装贴片设备持续优化核心架构，解决设备行业核心 痛点，已推出3μm高精度贴片类设备，可应用于Chiplet专用设备领域，可实现国产替代。部分设备可用 于军工级传感器组装和航天科技微波器件组装领域，相关微组装设备已进入中国航天科技集团公司九院 704所、中航光电、西安微电子技术研究所等供应链体系。 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 在全球AI加速演进的当下，算力已成为推动科技创新的核心引擎。从ChatGPT到DeepSeek，从多 模态大模型到Agent应用，指数级攀升的算力需求正在重塑半导体产业格局。与此同时，摩尔定律 趋缓、先进制程逼近物理极限，国际巨头纷纷押注Chiplet、CPO、3D-IC 等先进封装路线，产业 生态主导权日益集中。 对中国半导体而言，如何突破"低端锁定"，实现设计—制造—封测—EDA的全链条自主协同，已 成为迫在眉睫的战略课题。在这样的背景下，9月23日下午，由珠海硅芯科技有限公司与机械工业 出版社与联合发起的"引领AI算力'芯'时代——开创半导体产业新纪元"主题论坛在北京成功举办。 本次论坛由专攻2.5D / 3D堆叠芯片EDA领域的硅芯科技牵头组织，将分散在不同领域的议题包括 CPO、RISC-V、EDA/IP、存算一体这些高耦合、跨领域的议题首次整合进一场系统性论坛，既 打破了过去"各说各话"的局面，也标志着产业层面对"系统级协同"的认知正在提升。值得注意的 是，硅芯与机械工业出版社的合作，不仅是技术层面的联合，更是产业与知识平台的结合：前者深 耕产业痛点与工程 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 随着晶体管不断缩小，芯片尺寸达到光罩极限，将大芯片分割成更小的 Chiplet，通过2.5D、3D堆叠打破制程限制便成为破局关键。 其中，玻璃基板封装由于其物理特性更优、能实现比硅更大的封装尺寸，电气性能更好、能够减少传输损耗，能够有效对抗翘曲问题等优点， 被认为是提升芯片性能的关键材料技术。而在玻璃基板技术的发展中， TGV（玻璃通孔）的技术成熟度是关键所在。 玻璃通孔 (TGV) ，是玻璃芯基板的支柱之一，为更紧凑、更强大的设备铺平了道路，有助于提高层间连接密度。从实际应用中来看，这些通孔 有助于提高高速电路的信号完整性，连接之间的距离减小可减少信号损失和干扰，从而提高整体性能。 同时，TGV 的集成可以通过消除对单独互连层的需求来简化制造流程。然而从实际来看，尽管TGV 具有诸多优势，但也面临许多挑战—— 不 ...

Core Viewpoint - The Chiplet concept sector is experiencing a strong performance, with notable gains in specific stocks such as Pengding Holdings reaching the daily limit increase [1] Company Summary - Pengding Holdings has hit the daily limit increase, indicating strong investor interest and confidence in the stock [1] - Jintuo Co. and Lihexing are also among the stocks showing significant gains, reflecting a broader positive trend in the Chiplet sector [1]

Core Viewpoint - Chipone Technology (688521.SH), a leading company in the domestic semiconductor IP and chip customization sector, experienced a stock price surge, reaching the daily limit of 20% following the announcement of record-high new orders and a strategic acquisition plan [1][2][3]. Group 1: Financial Performance - As of September 11, 2025, Chipone signed new orders worth 1.205 billion yuan, marking a significant increase of 85.88% compared to the entire third quarter of 2024 [2][3]. - The total order backlog reached 3.025 billion yuan by the end of June 2025, representing a 23.17% increase from the end of the first quarter of 2025 [2][3]. - Approximately 64% of the new orders are related to AI computing, indicating a strong market demand in this segment [2][3]. Group 2: Strategic Developments - Chipone announced plans to acquire a 97.0070% stake in Chip Lai Technology to enhance its industry footprint [1][6]. - The acquisition is expected to strengthen Chipone's capabilities in AI ASIC design and improve its market competitiveness in key business areas [7][8]. - The company raised 1.807 billion yuan through a private placement to fund projects related to AIGC and smart mobility, as well as new IP development [1][8]. Group 3: Market Sentiment - The market has reacted positively to Chipone's announcements, with a significant increase in institutional holdings, reaching a record high of 142 million shares held by 632 funds [4][5]. - The stock price has seen substantial growth, increasing 6.51 times since September 18, 2024, and 2.5 times since the beginning of 2025 [4][5]. - Analysts expect that as the company's strategic initiatives progress and orders convert into revenue, its financial performance will improve significantly [9].

Core Insights - The semiconductor packaging and testing technology has become a crucial element in overcoming the dual challenges of "physical limits" and "industrial chain disruptions" in the context of the global semiconductor industry's rapid transformation and geopolitical tensions [1] Group 1: Industry Trends - The advanced packaging sector is seen as a core pathway to continue Moore's Law, with technologies such as 2.5D/3D, Chiplet, and Fan-Out accelerating the integration of design and manufacturing [1] - The geopolitical landscape is reshaping supply chains, necessitating a dual approach of self-sufficiency and globalization for China's packaging industry [1] Group 2: Regional Developments - Jiangsu province, holding nearly half of the national packaging capacity, has become a significant hub for the semiconductor packaging industry, with the Yangtze River Delta region accounting for over 81% of the national total [2] - By 2024, Jiangsu's packaging revenue is projected to exceed 170 billion yuan, with key enterprises achieving breakthroughs in system-level packaging and 2.5D packaging technologies [2] Group 3: Market Dynamics - The domestic integrated circuit industry has seen a continuous increase in prosperity, with sales reaching 1,045.8 billion yuan, a year-on-year growth of 18% [3] - The advanced packaging market is growing at a rate that outpaces traditional packaging, driven by the demand for high-density, diversified, and miniaturized packaging solutions [3]

Core Insights - The emergence of numerous domestic AI models in 2023 highlights the increasing demand for computing power in various sectors, including cloud computing, smart manufacturing, and intelligent finance [1] - The AI industry is viewed as a certain growth area, with computing power being a necessary but not sufficient condition for success, emphasizing the need for a comprehensive advantage across multiple domains [1] - Wuxi's proposal for "chip-computing synergy" aims to leverage national strategies to enhance AI applications in various fields, including agriculture and urban governance [1] Computing Power Demand - The rapid growth of AI has led to an unprecedented demand for computing power, with estimates indicating a need for 260 trillion TeraFLOPS of computing power daily to support AI agents [2] - The deployment of NVIDIA H100 GPUs would require approximately 700,000 units daily, highlighting a significant gap between current manufacturing capacity and future demand [2] - Wuxi has initiated the establishment of a city-level intelligent computing cloud center to address the growing need for computing power [3] Chip Development and Advanced Processes - The demand for high-performance, low-power chips is increasing due to the high computing requirements of AI applications, despite the slowdown of Moore's Law [4] - The development of new AI System on Chip (SoC) projects in Wuxi aims to enhance performance, power efficiency, and scalability through advanced manufacturing techniques [5] - Wuxi's semiconductor industry is advancing with the establishment of a pilot line for advanced process photoresists, filling a gap in domestic capabilities [5] Advanced Packaging Technologies - Advanced packaging technologies are essential for overcoming challenges related to power consumption, memory, and cost in AI chip development [6] - The industry is shifting towards high-integration solutions like Chiplet architecture and 3D stacking to meet increasing computing density demands [6] - The market for Chiplet technology is projected to grow significantly, with a compound annual growth rate of 42.5% from 2024 to 2033 [7] CPO Technology and Market Dynamics - The rise of Co-Packaged Optics (CPO) technology is generating interest in the AI computing center sector, with potential implications for existing market structures [8] - CPO is expected to coexist with traditional optical modules in the near term, addressing different needs in data center interconnectivity [8] - Challenges remain for CPO implementation, including reliability, maintainability, and production yield issues, which need to be addressed for broader adoption [9]