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芯原股份20250822
2025-08-24 14:47
芯原股份 20250822 摘要 新元股份 2025 年上半年 IP 授权业务收入 2.8 亿元,同比增长 8.2%, 二季度单季收入环比接近翻倍,达 1.87 亿元,同比增长 16.97%。数 字 IP 贡献占比约 75%,模拟和射频 IP 收入显著提高。 2025 年上半年芯片设计收入 2.32 亿元,其中 52%与 AI 算力相关,14 纳米以下先进制程项目占比 63%,涵盖数据中心、智慧驾驶等领域。执 行中的芯片设计项目接近 100 个。 2025 年上半年量产业务收入 4.08 亿元,同比增长 20%,单季度环比 增长接近 80%,同比增长 11.65%。目前有 112 个量产项目,45 个项 目等待量产。 公司全球化运营保持稳定,境外销售收入占比约 40%,研发人员主要驻 扎国内,实现双循环发展模式。非芯片公司客户群体收入占比达 35.66%。 2025 年二季度 ISIC 业务新签订单超过 7 亿元,环比增长超过 700%, 同比增长超过 350%,量产新签订单接近 4 亿元。上半年消费电子行业 收入同比增长 70%,受端侧 AI 需求推动。 Q&A 新元股份在 2025 年上半年取得了哪些主要 ...
听众注册|中国系统级封装大会:中兴微、环旭电子、天成先进、沛顿、AT&S、英特神斯、华大九天、KLA等SiP大咖嘉宾坐镇
半导体行业观察· 2025-08-22 01:17
第九届中国系统级封装大会 SiP China 2025 SiP China2025以" 智聚芯能,异构互联——AI时代先进封装与Chiplet生态创新 "为主旨, 围绕先进封 装、Chiplet技术及异构集成、高速互连等方向 ,探讨SiP与先进封装。 AUG 26 时间 :2025年8月26-28日 地点 :深圳会展中心(福田)1号馆 会议室③ SiP China 2025 「会议日程与议题」 日在浮带参 >> 大会议程 << 主论坛: 8月26日 宏观趋势与生态共建 代文亮·创始人&总裁 主持人 芯和半导体科技(上海)股份有限公司 签到及入场 09:00-09:30 ● 智聚芯能,异构互联,共赢AI 09:30-09:55 时代机遇 代文亮·创始人&总裁 芯和半导体科技(上海) 股份有限公司 端侧Al的新趋势、新变革、 09:55-10:20 新发展 周强·创始人兼董事长 上海光羽芯辰科技有限公司 光电共封技术趋势与挑战 10:20-10:45 张阔·先进封装技术总监 中兴微电子 扇出型封装的趋势与挑战 10:45-11:10 O 李志成·工程中心處長 ASE日月光 电源管理模块与微型化 11:10-11: ...
9.25-26 苏州见!2025先进封装及热管理大会
材料汇· 2025-08-15 15:39
点击 最 下方 关注《材料汇》 , 点击"❤"和" "并分享 添加 小编微信 ,寻 志同道合 的你 正文 随着半导体工艺逼近物理极限,集成电路产业正加速向"超越摩尔"时代跃迁,芯片功率密度与发热量剧 增。5G、AI、HPC、数据中心等新兴领域对高效热管理技术提出迫切需求。先进封装与热管理技术成为 突破算力瓶颈、应对高功率密度挑战的核心引擎。基于此,启明产链将于 9月25-26日在江苏苏州举 办"2025先进封装及热管理大会" 。 本次大会由国家第三代半导体技术创新中心(苏州) 梁剑波教授担任大会主席,甬江实验室作为支持单 位, 目前已有19家单位确认演讲: 中国科学院化学研究所/甬江实验室/ 浙江大学绍兴研究院/哈尔滨工 业大学/中山大学/芯和半导体/青禾晶元/ 齐力半导体/ 芯力半导体/中国科学院深圳先进技术研究院/中 国科学院宁波材料技术与工程研究所。 01 INTRODUCTION 大会概况 2025先进封装及热管理大会聚焦高算力热管理挑战,设置 先进封装与异质异构论坛、高算力热管理创新 论坛、液冷技术与市场应用论坛三大板块, 围绕chiplet、2.5D/3D等先进封装技术、以及热界面材料、 碳基(金 ...
Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
GlobeNewswire News Room· 2025-08-04 21:00
Core Insights - Arteris, Inc. has announced a licensing agreement with AMD for its FlexGen network-on-chip (NoC) interconnect IP, aimed at enhancing the performance of AMD's next-generation AI chiplet designs [1][3] - The collaboration emphasizes the growing complexity of modern system-on-chip (SoC) and chiplet architectures, which require multiple specialized interconnects to meet the demands of contemporary electronic systems [2] Company Overview - Arteris is recognized as a leader in semiconductor system IP, focusing on accelerating the creation of high-performance, power-efficient silicon [5] - The FlexGen NoC IP technology is designed to optimize wire length, reduce latency, and improve power efficiency, addressing the needs of complex multi-die and chiplet-based designs [3][4] Strategic Collaboration - The integration of Arteris' FlexGen NoC IP with AMD's Infinity Fabric™ interconnect is expected to enhance performance and scalability for diverse applications, from data centers to edge devices [2][3] - This partnership aims to automate interconnect configuration and enable seamless connectivity among SoC components, strengthening AMD's AI compute portfolio [3] Technological Innovation - FlexGen leverages AI automation to improve design productivity and streamline iteration cycles, positioning companies to tackle the complexities of modern computing systems [4] - The technology can function as an independent interconnect solution or in conjunction with proprietary interconnect technologies, facilitating faster design iterations and market readiness [3]
每日复盘-20250725
Guoyuan Securities· 2025-07-25 14:47
Market Performance - On July 25, 2025, all three major A-share indices experienced a decline: the Shanghai Composite Index fell by 0.33%, the Shenzhen Component Index decreased by 0.22%, and the ChiNext Index dropped by 0.23%[2] - The total market turnover was 17,869.82 billion yuan, a decrease of 574.20 billion yuan from the previous trading day[2] Sector and Style Analysis - Among the 30 CITIC first-level industries, the top performers were: Computer (1.30%), Electronics (1.26%), and Light Industry Manufacturing (0.54%); the worst performers included: Building Materials (-2.10%), Construction (-2.01%), and Food & Beverage (-1.68%)[20] - Growth stocks outperformed value stocks, with mid-cap growth leading the performance rankings[20] Capital Flow - On July 25, 2025, the net outflow of main funds was 573.43 billion yuan, with large orders seeing a net outflow of 272.56 billion yuan and small orders continuing to see a net inflow of 522.47 billion yuan[24] - Southbound funds recorded a net inflow of 70.52 billion HKD, with the Shanghai-Hong Kong Stock Connect contributing 39.00 billion HKD and the Shenzhen-Hong Kong Stock Connect contributing 31.52 billion HKD[26] ETF Trading Activity - Major ETFs such as the Huaxia SSE 50 ETF and the Huatai-PB CSI 300 ETF saw varied trading volumes, with the Huaxia SSE 50 ETF at 16.71 billion yuan, reflecting a change of +0.95 billion yuan from the previous day[29] - The CSI 1000 ETF had a significant inflow of 16.68 billion yuan on July 24, indicating strong investor interest[29] Global Market Overview - On July 25, 2025, major Asia-Pacific indices showed mixed results, with the Hang Seng Index down 1.09% and the Nikkei 225 down 0.89%[33] - In the U.S. market, the Dow Jones Industrial Average fell by 0.70%, while the S&P 500 and Nasdaq Composite saw slight increases of 0.07% and 0.18%, respectively[33]
博通叫停西班牙十亿美元芯片工厂计划
美股研究社· 2025-07-15 10:28
Core Viewpoint - Broadcom has officially terminated its plan to invest approximately $1 billion in a semiconductor packaging and testing factory in Spain, marking a setback for the EU's ambitions to expand local chip production [4][6]. Group 1: Project Background - The project was announced in July 2023 and was seen as a significant step for the EU's semiconductor industry, with Spain's government planning to allocate €12 billion from the EU's COVID-19 recovery fund to support the semiconductor sector, including Broadcom's initiative [6]. - The factory was intended to be the first backend facility on the European continent, focusing on advanced packaging and testing [6]. Group 2: Negotiation Breakdown - Negotiations between Broadcom and the Spanish government stalled due to three main issues: 1. The timing of subsidy disbursement, with Broadcom seeking upfront capital expenditure subsidies while the Spanish government preferred milestone-based payments [8]. 2. Environmental assessments and land use permits, which faced additional restrictions from local authorities, potentially extending the approval process to 18 months [9]. 3. Political factors, including upcoming elections in Spain and changes in U.S. Department of Commerce personnel, which complicated the agreement [10][11]. Group 3: Strategic Adjustments - Following the project cancellation, Broadcom is accelerating expansion at its existing facilities in Malaysia and Vietnam, planning to invest an additional $500 million to $700 million by 2026 to compensate for the lost capacity from the Spain project [12][13]. - The company is also enhancing collaborations with leading semiconductor partners like TSMC and ASE in advanced packaging technologies, crucial for its AI accelerator and networking chip businesses [12][13]. - Broadcom's investment strategy is shifting towards software and solutions, moving away from capital-intensive semiconductor manufacturing, reflecting a broader strategic transformation within the company [14].
芯原股份: 国泰海通证券股份有限公司关于芯原微电子(上海)股份有限公司使用募集资金置换预先投入募投项目及已支付发行费用的自筹资金的核查意见
Zheng Quan Zhi Xing· 2025-07-14 16:28
Group 1 - The company has raised a total of RMB 1,806,856,851.88 through the issuance of 24,860,441 shares at a price of RMB 72.68 per share, with a net amount of RMB 1,780,262,125.56 after deducting issuance costs [1][2] - The raised funds are allocated for projects in the AIGC and smart mobility sectors, with a total investment of RMB 180,815.69 million, of which RMB 180,685.69 million is planned to be funded by the raised capital [2][3] - The company has pre-invested RMB 38,453.54 million of its own funds into the projects from December 22, 2023, to May 31, 2025, and plans to replace this with the raised funds [2][4] Group 2 - The company has incurred issuance costs totaling RMB 2,659.47 million, of which RMB 416.01 million was paid from its own funds prior to the capital being raised, and it intends to replace this amount with the raised funds [4][5] - The board of directors has approved the use of raised funds to replace pre-invested self-raised funds and issuance costs, confirming that this does not alter the intended use of the funds or harm shareholder interests [6][7] - The independent auditor, Deloitte, has verified the pre-invested funds and issuance costs, confirming compliance with relevant regulations and reflecting the actual expenditures accurately [7][8]
易天股份(300812) - 2025年7月9日投资者关系活动记录表
2025-07-09 11:06
Group 1: Company Overview and Financial Performance - In 2024, the company achieved total revenue of approximately 390 million CNY, with a net profit attributable to shareholders of -109 million CNY, primarily due to delays in customer production lines and extended acceptance cycles [3] - For Q1 2025, the company reported total revenue of 140 million CNY, a year-on-year increase of 89.23%, and a net profit of 20.09 million CNY, up 250.81% compared to the previous year [3] - The increase in Q1 2025 revenue and profit was attributed to a rise in acceptable order amounts and improved gross margins, alongside better collection of accounts receivable [3] Group 2: Research and Development Achievements - The company has increased R&D investment to strengthen its position in the flat panel display equipment industry and expand into new display and semiconductor equipment fields [4] - In the LCD display equipment sector, the company has enhanced its technology capabilities for large-size module assembly, launching cleaning and bonding lines for 88-inch, 100-inch, and 130-inch displays [4] Group 3: Market Position and Client Relationships - The company has developed a range of equipment for VR/AR/MR display technologies, including Micro OLED and various assembly and testing devices, securing orders from clients such as Visionox Technology and GoerTek [5] - In the flexible OLED display equipment sector, the company has established strong partnerships with major manufacturers like BOE and Visionox, and has won a bid for BOE's 8.6 generation AMOLED production line project [6] Group 4: Subsidiary Performance and Future Plans - The subsidiary, Micro Group Semiconductor, reported over 21% revenue growth in 2024, with new products filling market gaps in Mini LED repair equipment and advancements in medical device assembly lines [7] - The company is exploring mergers and acquisitions to enhance its business and resource integration, aiming for sustainable high-quality development [8][9]
芯原股份18亿定增完成累募36.7亿 大股东易方达加码持股首季仍未扭亏
Chang Jiang Shang Bao· 2025-07-03 08:24
Group 1 - Chip Origin Co., Ltd. (芯原股份) successfully completed a private placement of A-shares, raising a total of 1.807 billion yuan by issuing 24.86 million shares at a price of 72.68 yuan per share [1] - The initial plan was to issue up to 50.09 million shares, indicating that the actual issuance was less than half of the maximum proposed [1] - The private placement involved 11 institutional investors, including major fund management companies and securities firms, with E Fund Management being the largest subscriber, contributing approximately 755 million yuan, accounting for 42% of the total raised [1][2] Group 2 - Chip Origin Co., Ltd. has previously raised a total of approximately 3.67 billion yuan through two rounds of equity financing, with the first round occurring during its IPO in August 2020 [2] - The funds raised from the latest private placement will be primarily allocated to research and development projects in the AIGC and smart mobility sectors, focusing on Chiplet solutions and new generation IP development [2] - The company specializes in providing platform-based, comprehensive, and one-stop chip customization services and semiconductor IP licensing, with a portfolio of various processor IPs and over 1,600 mixed-signal and RF IPs [3] Group 3 - Despite its technological capabilities, the company faces financial challenges, with projected revenues of 2.338 billion yuan and 2.322 billion yuan for 2023 and 2024, respectively, alongside significant R&D expenditures [3] - The company reported a net loss of 296 million yuan in 2023 and is expected to incur a larger loss of 601 million yuan in 2024 [3] - In the first quarter of this year, the company achieved a revenue of 390 million yuan, reflecting a year-on-year growth of 22.49%, but still reported a net loss of 220 million yuan [3]
芯原股份: 国泰海通证券股份有限公司关于芯原微电子(上海)股份有限公司2023年度向特定对象发行A股股票之上市保荐书
Zheng Quan Zhi Xing· 2025-07-02 16:14
Core Viewpoint - The company, VeriSilicon Microelectronics (Shanghai) Co., Ltd., is focused on providing comprehensive chip customization services and semiconductor IP licensing, leveraging its proprietary semiconductor IP to cater to various applications, including AI, consumer electronics, and automotive sectors [1][2][4]. Group 1: Company Overview - The company was established on August 21, 2001, and became a joint-stock company on March 26, 2019, with its shares listed on the Shanghai Stock Exchange under the stock code 688521.SH since August 18, 2020 [1][3]. - The total share capital of the company is 525,713,273 shares, and it operates primarily in the semiconductor industry, providing services such as chip design, modeling, and technical consulting [1][4]. Group 2: Main Business and Services - The company specializes in semiconductor IP, offering a wide range of processor IPs, including graphics, neural network, video, digital signal, image signal, and display processors, along with over 1,600 mixed-signal and RF IPs [1][5][9]. - The main business includes a one-stop chip customization service that encompasses the entire process from design to manufacturing, packaging, and testing, aimed at reducing design risks and shortening development cycles for clients [5][6]. Group 3: Market Position and Financial Performance - In 2023, the company ranked first in the semiconductor IP licensing market in mainland China and eighth globally, with its licensing revenue ranking sixth worldwide [5]. - The company reported a total revenue of 2.68 billion yuan in 2023, with a significant increase in net profit, turning from a loss of 29.65 million yuan in 2022 to a profit of 7.38 million yuan in 2023 [11][14]. Group 4: Research and Development - The company has consistently invested in R&D, with a focus on chip customization technology, software technology, and semiconductor IP technology, accumulating a substantial number of patents and intellectual property rights [10][12]. - As of December 31, 2024, the company had obtained 205 invention patents, 3 utility model patents, and 12 software copyrights, reflecting its commitment to innovation and technology advancement [10][12]. Group 5: Future Plans and Fundraising - The company plans to raise approximately 1.81 billion yuan through a private placement of shares, with the funds allocated to projects in the AIGC and smart mobility sectors, as well as new IP development [22][26]. - The issuance is set to take place on June 12, 2025, with a share price of 72.68 yuan, and the funds will be used to enhance the company's operational capabilities and long-term profitability [22][24].