Core Viewpoint - Hefei Qizhong Technology Co., Ltd. is planning to issue convertible bonds to raise funds for specific projects, including advanced packaging and testing technologies, which are expected to enhance production capacity and operational efficiency [1][2]. Summary by Sections Project Overview - The funds raised will be allocated to two main projects: high-pin-count micro-sized bump packaging and testing, and the technological transformation of advanced power and flip-chip packaging at Hefei Qizhong Technology (Suzhou) Co., Ltd. [1][2]. - The high-pin-count micro-sized bump packaging project aims to expand existing production capacity for copper-nickel-gold bumping, CP, COG, and COF [1][2]. Financial Details - The total investment for the projects is estimated at 419.453 million yuan, with construction costs accounting for 403.453 million yuan, including renovation, hardware and software purchases, and working capital [3][7]. - The breakdown of the investment includes 66.44 million yuan for renovation, 333.691 million yuan for hardware and software, and 16 million yuan for working capital [3][7]. Feasibility and Necessity - The necessity and urgency of the projects are justified by industry trends, customer demands, and the company's operational plans, indicating a significant impact on future performance [2][3]. - The company has assessed its existing technology and personnel reserves, confirming the feasibility of the projects without major uncertainties [2][3]. Capacity Planning - The projects are expected to significantly increase production capacity, with specific targets set for various products, including copper-nickel bumping and advanced power packaging [9][11]. - The planned production capacity includes 18 million pieces for copper-nickel bumps and 3.96 billion pieces for COG [11]. Revenue Projections - The expected annual sales revenue from the high-pin-count micro-sized bump packaging project is projected to be 355.8754 million yuan once fully operational [9][10]. - The advanced power and flip-chip packaging project is anticipated to generate annual sales revenue of 345.8381 million yuan upon reaching full capacity [9][10]. Cost and Profitability Analysis - The cost structure includes direct materials, labor, and manufacturing expenses, with careful consideration of historical data and market trends for cost estimation [10][11]. - The gross profit margins for the new products are expected to be competitive, with specific margins projected for different product lines [10][11].